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Toward Broadband Photodetection: Band Alignment and Interlayer Charge Transfer in 2D Transition Metal Dichalcogenides/3D-Ga2O3 Hybrid-Dimensional Heterostructures

  • Xudan Zhu
  • , Weiming Liu
  • , Chuanxiang Sheng
  • , Chunxiao Cong
  • , Xin Chen
  • , Hongyu Tang
  • , Yi Luo
  • , Shaojuan Li
  • , Junhao Chu
  • , Rongjun Zhang*
  • *此作品的通讯作者
  • Fudan University
  • CAS - Shanghai Institute of Technical Physics
  • Microsystem and Terahertz Research Center
  • CAS - Changchun Institute of Optics Fine Mechanics and Physics

科研成果: 期刊稿件文章同行评审

摘要

Recently, various transition metal dichalcogenides (TMDs)/Ga2O3 heterostructures have emerged as excellent candidates for the development of broadband photodetection, exhibiting various merits such as broadband optical absorption, efficient interlayer carrier transfer, a relatively simple fabrication process, and potential for flexibility. In this work, vertically stacked MoSe2/Ga2O3, WS2/Ga2O3, and WSe2/Ga2O3 heterostructures were experimentally synthesized, all exhibiting broadband light absorption, spanning at least from 200 to 800 nm. The absorption coefficients of these TMDs/Ga2O3 heterostructures are significantly improved compared to those of individual Ga2O3 films. The superior performance can be attributed to the type-I band alignment and efficient interlayer carrier transfer, which result from various band offsets along with the different doping conditions of the TMD layers, leading to distinct photoluminescence (PL) emission properties. Through a detailed analysis of the excitation-power-dependent PL spectra, we offer an in-depth discussion of the interlayer carrier transfer mechanism in the TMDs/Ga2O3 heterostructures. Regarding interlayer coupling effects, the shift of the EF of TMD layers plays a crucial role in modulating their trion emission properties. These findings suggest that these three TMDs/Ga2O3 heterostructures have great potential in broadband photodetection, and our in-depth physical mechanism analysis lays a solid foundation for a new device design.

源语言英语
页(从-至)15446-15456
页数11
期刊ACS Applied Materials and Interfaces
16
12
DOI
出版状态已出版 - 27 3月 2024
已对外发布

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