TY - GEN
T1 - Study on the Anti-Crack Propagation Behavior of a Submicron Pore-Enriched Elastomer Composite
AU - Shen, Junhao
AU - Han, Pengyang
AU - Zuo, Shaohua
AU - Shi, Fuwen
AU - Gao, Canguan
AU - Yu, Zhe
AU - Bi, Hengchang
AU - Wu, Xing
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Elastomeric materials play a pivotal role in the composition of flexible sensors and actuators, garnering significant attention within the realm of flexible electronics. However, the failure reliability problem of intrinsically isotropic elastomers due to crack propagation still exists. In this work, an elastomeric composite enriched in submicron voids was fabricated by overfilling silicone rubber with small-sized carbon black (CB) particles. Different from the intrinsic silicone rubber film, the porous carbon black/silicone rubber composite exhibits unusual anti-crack propagation behavior. The dynamic evolution of the morphology at the crack tip of the composite was observed by in situ scanning electron microscopy (SEM), revealing the anisotropic transformation mechanism caused by the strain on the composite.
AB - Elastomeric materials play a pivotal role in the composition of flexible sensors and actuators, garnering significant attention within the realm of flexible electronics. However, the failure reliability problem of intrinsically isotropic elastomers due to crack propagation still exists. In this work, an elastomeric composite enriched in submicron voids was fabricated by overfilling silicone rubber with small-sized carbon black (CB) particles. Different from the intrinsic silicone rubber film, the porous carbon black/silicone rubber composite exhibits unusual anti-crack propagation behavior. The dynamic evolution of the morphology at the crack tip of the composite was observed by in situ scanning electron microscopy (SEM), revealing the anisotropic transformation mechanism caused by the strain on the composite.
KW - anisotropy
KW - anti-crack propagation
KW - elastomeric materials
UR - https://www.scopus.com/pages/publications/85206589665
U2 - 10.1109/IPFA61654.2024.10691079
DO - 10.1109/IPFA61654.2024.10691079
M3 - 会议稿件
AN - SCOPUS:85206589665
T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
BT - 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024
Y2 - 15 July 2024 through 18 July 2024
ER -