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Structure-property relationships in graphene-based strain and pressure sensors for potential artificial intelligence applications

  • Zewei Luo
  • , Xiaotong Hu
  • , Xiyue Tian
  • , Chen Luo
  • , Hejun Xu
  • , Quanling Li
  • , Qianhao Li
  • , Jian Zhang
  • , Fei Qiao*
  • , Xing Wu
  • , V. E. Borisenko
  • , Junhao Chu
  • *此作品的通讯作者
  • East China Normal University
  • Fudan University
  • Tsinghua University
  • Belarusian State University of Informatics and Radioelectronics
  • Moscow Engineering Physics Institute

科研成果: 期刊稿件文献综述同行评审

摘要

Wearable electronic sensing devices are deemed to be a crucial technology of smart personal electronics. Strain and pressure sensors, one of the most popular research directions in recent years, are the key components of smart and flexible electronics. Graphene, as an advanced nanomaterial, exerts pre-eminent characteristics including high electrical conductivity, excellent mechanical properties, and flexibility. The above advantages of graphene provide great potential for applications in mechatronics, robotics, automation, human-machine interaction, etc.: graphene with diverse structures and leverages, strain and pressure sensors with new functionalities. Herein, the recent progress in graphene-based strain and pressure sensors is presented. The sensing materials are classified into four structures including 0D fullerene, 1D fiber, 2D film, and 3D porous structures. Different structures of graphene-based strain and pressure sensors provide various properties and multifunctions in crucial parameters such as sensitivity, linearity, and hysteresis. The recent and potential applications for graphene-based sensors are also discussed, especially in the field of human motion detection. Finally, the perspectives of graphene-based strain and pressure sensors used in human motion detection combined with artificial intelligence are surveyed. Challenges such as the biocompatibility, integration, and additivity of the sensors are discussed as well.

源语言英语
文章编号1250
期刊Sensors
19
5
DOI
出版状态已出版 - 3月 2019

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