摘要
AlN thin films have been grown on Al-covered Si(100) substrates using nitridation in high-purity nitrogen ambient, where the Al layer was previously deposited by ultrahigh vacuum (UHV) electron beam evaporation. The temperature of nitridation plays an important role in the formation of AlN films. The films have been characterized by x-ray diffraction, Fourier transform infrared spectroscopy, atomic force microscopy, transmission electron microscopy, and spreading resistance profile. Results indicate that the AlN films formed by nitridation at 1000 °C for 30 min exhibit the preferred orientation of (002), with spreading resistance above 108Ω.
| 源语言 | 英语 |
|---|---|
| 页(从-至) | 225-227 |
| 页数 | 3 |
| 期刊 | Journal of Electronic Materials |
| 卷 | 28 |
| 期 | 3 |
| DOI | |
| 出版状态 | 已出版 - 3月 1999 |
| 已对外发布 | 是 |
| 活动 | Proceedings of the 1998 40th Electronic Materials Conference, EMC-98 - Charlottesville, VA, USA 期限: 24 6月 1998 → 26 6月 1998 |
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