Strain-Invariant Conductors from Liquid Metal and Silver Microsheets

Junhao Shen; Jiajie Cui; Zewen Gan; Shaohua Zuo; Fuwen Shi; Tao Wang; Hengchang Bi; Xing Wu

doi:10.1109/IPFA65338.2025.11256712

Strain-Invariant Conductors from Liquid Metal and Silver Microsheets

Junhao Shen
, Jiajie Cui
, Zewen Gan
, Shaohua Zuo
, Fuwen Shi
, Tao Wang
, Hengchang Bi
, Xing Wu^*

^*此作品的通讯作者

通信与电子工程学院

East China Normal University
East China University of Science and Technology

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

摘要

Flexible and stretchable metal conductors are essential for next-generation wearable electronics. However, ensuring their electrical stability under extreme tensile deformations poses a significant challenge. In this study, silver sheets (AgMS), arranged in a planar configuration, are deposited onto the surface of liquid metal (LM), specifically the eutectic gallium-indium alloy (EGaIn), using the Langmuir-Blodgett (LB) technique. Due to the strain-insensitive electron transport mechanism between the two materials, the LMI AgMS flexible wires maintain nearly unchanged electrical performance under extreme strain (300%, R/Ro = 2.07), presenting a novel strategy for designing strain-insensitive stretchable wires.

源语言	英语
主期刊名	2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025
出版商	Institute of Electrical and Electronics Engineers Inc.
ISBN（电子版）	9798331549428
DOI	https://doi.org/10.1109/IPFA65338.2025.11256712
出版状态	已出版 - 2025
活动	32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025 - Bayan Lepas, 马来西亚期限: 5 8月 2025 → 8 8月 2025

丛书

姓名	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
ISSN（印刷版）	1946-1542
ISSN（电子版）	1946-1550

会议

会议	32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025
国家/地区	马来西亚
市	Bayan Lepas
时期	5/08/25 → 8/08/25

访问文件

10.1109/IPFA65338.2025.11256712

其它文件与链接

链接到 Scopus 的出版物

引用此

Shen, J., Cui, J., Gan, Z., Zuo, S., Shi, F., Wang, T., Bi, H., & Wu, X. (2025). Strain-Invariant Conductors from Liquid Metal and Silver Microsheets. 在 2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPFA65338.2025.11256712

Shen, Junhao ; Cui, Jiajie ; Gan, Zewen 等. / Strain-Invariant Conductors from Liquid Metal and Silver Microsheets. 2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025. Institute of Electrical and Electronics Engineers Inc., 2025. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

@inproceedings{c2446d7e3d954f85826f1ccf5b1d9e9f,

title = "Strain-Invariant Conductors from Liquid Metal and Silver Microsheets",

abstract = "Flexible and stretchable metal conductors are essential for next-generation wearable electronics. However, ensuring their electrical stability under extreme tensile deformations poses a significant challenge. In this study, silver sheets (AgMS), arranged in a planar configuration, are deposited onto the surface of liquid metal (LM), specifically the eutectic gallium-indium alloy (EGaIn), using the Langmuir-Blodgett (LB) technique. Due to the strain-insensitive electron transport mechanism between the two materials, the LMI AgMS flexible wires maintain nearly unchanged electrical performance under extreme strain (300\%, R/Ro = 2.07), presenting a novel strategy for designing strain-insensitive stretchable wires.",

keywords = "failure analysis, Langmuir-Blodgett, reliability, stretchable wire",

author = "Junhao Shen and Jiajie Cui and Zewen Gan and Shaohua Zuo and Fuwen Shi and Tao Wang and Hengchang Bi and Xing Wu",

note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025 ; Conference date: 05-08-2025 Through 08-08-2025",

year = "2025",

doi = "10.1109/IPFA65338.2025.11256712",

language = "英语",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025",

address = "美国",

}

Shen, J, Cui, J, Gan, Z, Zuo, S, Shi, F, Wang, T, Bi, H & Wu, X 2025, Strain-Invariant Conductors from Liquid Metal and Silver Microsheets. 在 2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Institute of Electrical and Electronics Engineers Inc., 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025, Bayan Lepas, 马来西亚, 5/08/25. https://doi.org/10.1109/IPFA65338.2025.11256712

Strain-Invariant Conductors from Liquid Metal and Silver Microsheets. / Shen, Junhao; Cui, Jiajie; Gan, Zewen 等.
2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025. Institute of Electrical and Electronics Engineers Inc., 2025. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

TY - GEN

T1 - Strain-Invariant Conductors from Liquid Metal and Silver Microsheets

AU - Shen, Junhao

AU - Cui, Jiajie

AU - Gan, Zewen

AU - Zuo, Shaohua

AU - Shi, Fuwen

AU - Wang, Tao

AU - Bi, Hengchang

AU - Wu, Xing

PY - 2025

Y1 - 2025

N2 - Flexible and stretchable metal conductors are essential for next-generation wearable electronics. However, ensuring their electrical stability under extreme tensile deformations poses a significant challenge. In this study, silver sheets (AgMS), arranged in a planar configuration, are deposited onto the surface of liquid metal (LM), specifically the eutectic gallium-indium alloy (EGaIn), using the Langmuir-Blodgett (LB) technique. Due to the strain-insensitive electron transport mechanism between the two materials, the LMI AgMS flexible wires maintain nearly unchanged electrical performance under extreme strain (300%, R/Ro = 2.07), presenting a novel strategy for designing strain-insensitive stretchable wires.

AB - Flexible and stretchable metal conductors are essential for next-generation wearable electronics. However, ensuring their electrical stability under extreme tensile deformations poses a significant challenge. In this study, silver sheets (AgMS), arranged in a planar configuration, are deposited onto the surface of liquid metal (LM), specifically the eutectic gallium-indium alloy (EGaIn), using the Langmuir-Blodgett (LB) technique. Due to the strain-insensitive electron transport mechanism between the two materials, the LMI AgMS flexible wires maintain nearly unchanged electrical performance under extreme strain (300%, R/Ro = 2.07), presenting a novel strategy for designing strain-insensitive stretchable wires.

KW - failure analysis

KW - Langmuir-Blodgett

KW - reliability

KW - stretchable wire

UR - https://www.scopus.com/pages/publications/105030017696

U2 - 10.1109/IPFA65338.2025.11256712

DO - 10.1109/IPFA65338.2025.11256712

M3 - 会议稿件

AN - SCOPUS:105030017696

T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

BT - 2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025

Y2 - 5 August 2025 through 8 August 2025

ER -

Shen J, Cui J, Gan Z, Zuo S, Shi F, Wang T 等. Strain-Invariant Conductors from Liquid Metal and Silver Microsheets. 在 2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025. Institute of Electrical and Electronics Engineers Inc. 2025. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA65338.2025.11256712

Strain-Invariant Conductors from Liquid Metal and Silver Microsheets

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