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SiC Trench MOSFET with N-base Super Barrier Rectifier Embedded for Optimizing Reverse Characteristic

  • East China Normal University

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

摘要

A novel double trench SiC MOSFET embedded with N-base super barrier rectifier (NSBR-DTMOS) is proposed in this paper. The NSBR-DTMOS exhibits its diode turn on voltage (VF) half lower than that of body diode. With the super barrier rectifier (SBR) embedded as the freewheeling diode, the bipolar degradation phenomena caused by the body diode is eliminated successfully. Compared with the conventional DTMOS, the gate-to-drain capacitance (CGD) and gate-drain charge (QGD) are reduced by half, at the cost of the specific ON-resistance (Ron) increases by 9% only. As a result, the figures of merit Ron×QG and Ron×QGD are improved by 45% and 54% respectively.

源语言英语
主期刊名2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021
出版商Institute of Electrical and Electronics Engineers Inc.
页101-102
页数2
ISBN(电子版)9781665417471
DOI
出版状态已出版 - 2021
活动2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021 - Zhuhai, 中国
期限: 24 11月 2021 → 26 11月 2021

丛书

姓名2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021

会议

会议2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021
国家/地区中国
市Zhuhai
时期24/11/21 → 26/11/21

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