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Self-rectifying and forming-free unipolar HfO x based-high performance RRAM built by fab-avaialbe materials

  • X. A. Tran*
  • , B. Gao
  • , J. F. Kang
  • , X. Wu
  • , L. Wu
  • , Z. Fang
  • , Z. R. Wang
  • , K. L. Pey
  • , Y. C. Yeo
  • , A. Y. Du
  • , M. Liu
  • , B. Y. Nguyen
  • , M. F. Li
  • , H. Y. Yu
  • *此作品的通讯作者
  • Nanyang Technological University
  • Peking University
  • Agency for Science, Technology and Research, Singapore
  • National University of Singapore
  • Global Foundries, Inc.
  • CAS - Institute of Microelectronics
  • Soitec S.A.
  • Fudan University

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

In this paper, we report a high performance, forming-free and self-rectifying unipolar HfO x based RRAM fabricated by fab-available materials. Highlight of the demonstrated RRAM include 1) CMOS technology friendly materials and process, 2) excellent self-rectifying behavior in LRS (>10 3 @ 1 V), 3) forming-free unipolar resistive switching, 4) wide read-out margin for high density cross-point memory devices (number of word-line >10 6 for worst case condition).

源语言英语
主期刊名2011 International Electron Devices Meeting, IEDM 2011
31.2.1-31.2.4
DOI
出版状态已出版 - 2011
已对外发布
活动2011 IEEE International Electron Devices Meeting, IEDM 2011 - Washington, DC, 美国
期限: 5 12月 20117 12月 2011

出版系列

姓名Technical Digest - International Electron Devices Meeting, IEDM
ISSN(印刷版)0163-1918

会议

会议2011 IEEE International Electron Devices Meeting, IEDM 2011
国家/地区美国
Washington, DC
时期5/12/117/12/11

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