摘要
Driven by the growing demands in artificial intelligence, health detection, and human-machine interaction, flexible pressure sensors, an indispensable branch of wearable electronics, have attracted attention for their wide range of applications. The flexible pressure sensor with a three-dimensional (3D) porous conductive sponge as the sensitive layer, whose resistance value changes with external pressure stimulation, has become a cutting-edge device. However, there are still issues on the reliability of flexible porous pressure devices composed of soft matter under sustained large pressure loads. In this work, a flexible porous pressure device developed based on polydimethylsiloxane (PDMS)/carbon black (CB)-attached porous composite sensitive layer was fabricated. The results show that PDMS can be used as a homogeneous binder to assist CB in attaching stably to the porous framework surface, avoiding the slipping and detachment of CB under the large strain of the framework. Under continuous loadings at 1000 kPa, the PDMS/CB@PDMS device did not experience significant initial resistance drift.
| 源语言 | 英语 |
|---|---|
| 主期刊名 | 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 |
| 出版商 | Institute of Electrical and Electronics Engineers Inc. |
| ISBN(电子版) | 9798350301649 |
| DOI | |
| 出版状态 | 已出版 - 2023 |
| 活动 | 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 - Pulau Pinang, 马来西亚 期限: 24 7月 2023 → 27 7月 2023 |
出版系列
| 姓名 | Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA |
|---|---|
| 卷 | 2023-July |
会议
| 会议 | 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 |
|---|---|
| 国家/地区 | 马来西亚 |
| 市 | Pulau Pinang |
| 时期 | 24/07/23 → 27/07/23 |
联合国可持续发展目标
此成果有助于实现下列可持续发展目标:
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可持续发展目标 3 良好健康与福祉
指纹
探究 'Reliability study of the three-dimensional porous flexible resistive pressure sensor' 的科研主题。它们共同构成独一无二的指纹。引用此
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