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Photocatalytic degradation of tetracycline antibiotic by a novel Bi2Sn2O7/Bi2MoO6 S-scheme heterojunction: Performance, mechanism insight and toxicity assessment

  • Shijie Li
  • , Chunchun Wang
  • , Yanping Liu
  • , Mingjie Cai
  • , Yaning Wang
  • , Huiqiu Zhang
  • , Yang Guo
  • , Wei Zhao*
  • , Zhaohui Wang
  • , Xiaobo Chen
  • *此作品的通讯作者
  • Zhejiang Ocean University
  • Nanjing University
  • Changshu Institute of Technology
  • Ministry of Natural Resources of the People's Republic of China
  • Shanghai Engineering Research Center of Biotransformation of Organic Solid Waste
  • University of Missouri at Kansas City

科研成果: 期刊稿件文章同行评审

摘要

The fabrication of step-scheme (S-scheme) heterojunction with superior redox capability has been emerging as a prospective strategy for environmental remediation. Herein, novel Bi2Sn2O7/Bi2MoO6 S-scheme heterojunctions have been fabricated via in-situ anchoring Bi2Sn2O7 nanoparticles on Bi2MoO6 microspheres. The optimized Bi2Sn2O7/Bi2MoO6 (BSO/BMO-6%) attains the highest reaction rate constant (k) in the degradation of tetracycline hydrochloride (TC, k = 0.0397 min−1), which is 3.62 folds higher than that of pristine Bi2MoO6. Such an improvement is originated from more exposed active sites, higher photo-excited charge separation efficiency, superior redox ability, and efficient production of reactive h+, •OH and •O2–. Besides, Bi2Sn2O7/Bi2MoO6 could efficiently degrade the TC antibiotic in actual water matrix. Significantly, the toxicity evaluation verifies the nontoxicity of Bi2Sn2O7/Bi2MoO6. Moreover, the degradation pathways of TC are determined and the toxicity of degradation intermediates is appraised by using HPLC-MS spectra and QSAR prediction. A possible photocatalytic mechanism over S-scheme Bi2Sn2O7/Bi2MoO6 has been elucidated based on experimental studies combined with density functional theory (DFT) calculations. This work offers new insights for the design of high-performance S-scheme heterojunctions for environmental remediation.

源语言英语
文章编号132519
期刊Chemical Engineering Journal
429
DOI
出版状态已出版 - 1 2月 2022

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