@inproceedings{ebfd9cb7f0504bea8c57efe370b9c88a,
title = "Overload-Resistant Flexible Strain Sensor Based on Stacked Silver Microsheets",
abstract = "Reliability is essential for flexible strain sensors. However, the physical mechanism underlying the sensor suffering an overload condition remains unclear. This work fabricated strain sensors featuring multi-layer silver microsheet (AgMS) stacks using the Langmuir-Blodgett (LB) technique. Unlike conventional crack-based sensors, these sensors, after experiencing overload, maintain a consistently low resistance, thereby demonstrating outstanding overload resistance. Scanning electron microscopy (SEM) was employed to examine the microstructure of the sensing layer following cyclic overload testing, unveiling a novel strategy for enhancing overload resistance in flexible strain devices driven by the slip mechanism of the stacked microsheets.",
keywords = "crack, flexible strain sensor, LangmuirBlodgett, overload-resistant, reliability",
author = "Junhao Shen and Zewen Gan and Jiajie Cui and Shaohua Zuo and Fuwen Shi and Tao Wang and Hengchang Bi and Xing Wu",
note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025 ; Conference date: 05-08-2025 Through 08-08-2025",
year = "2025",
doi = "10.1109/IPFA65338.2025.11251494",
language = "英语",
series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025",
address = "美国",
}