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Microscopic Characterization of Failure Mechanisms in Long-Term Implanted Microwire Neural Electrodes

  • Z. J. Zhang
  • , Q. Li
  • , Z. Y. Dong
  • , W. T. Wang
  • , S. T. Lai
  • , X. Yang
  • , F. Liang
  • , C. L. Wang*
  • , C. Luo
  • , L. J. Lyu*
  • , Z. Li
  • , J. M. Xu
  • , X. Wu*
  • *此作品的通讯作者
  • East China Normal University

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

The development of integrated circuits greatly enhances brain-computer interface technology. The degradation of the implanted neural electrodes is a key issue. The scanning electron microscope and energy dispersive spectrometer techniques are used to characterize the evolution of the microscopic morphology and element migration of implanted microwire electrodes containing 32 channels together with the recorded neural signals at different implantation times. The spike amplitude decreases over time of implantation, leading to poorer identification of neural signals. The effect of degradation on the local field potential detection is neglectable. This work could guide the reliability improvement of the neural electrodes.

源语言英语
主期刊名2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781665456722
DOI
出版状态已出版 - 2023
活动61st IEEE International Reliability Physics Symposium, IRPS 2023 - Monterey, 美国
期限: 26 3月 202330 3月 2023

出版系列

姓名IEEE International Reliability Physics Symposium Proceedings
2023-March
ISSN(印刷版)1541-7026

会议

会议61st IEEE International Reliability Physics Symposium, IRPS 2023
国家/地区美国
Monterey
时期26/03/2330/03/23

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