跳到主要导航 跳到搜索 跳到主要内容

Magnetically Controlled Electroplating of NiFe/Cu Composite Wires

  • X. P. Li*
  • , Z. J. Zhao
  • , H. L. Seet
  • , W. M. Heng
  • , T. B. Oh
  • , J. Y. Lee
  • *此作品的通讯作者
  • National University of Singapore

科研成果: 期刊稿件文章同行评审

摘要

The effects of magnetic field on the plating material in magnetically controlled electroplating is investigated for the fabrication of microcomposite wire used in magnetoimpedance sensing elements. Composite wires of microcopper core plated with a layer of ferromagnetic material, NiFe, are produced by electroplating with and without an external magnetic field longitudinal to the wire. The results show that the presence of a magnetic field during plating enhances the NiFe composition ratio along the plated surface, and enhances the alignment of crystal grains of the plated material and the smoothness of the plated surface. The imposed external magnetic field modifies the magnetic anisotropy of the plated layer from circumferential to longitudinal.

源语言英语
页(从-至)C1-C3
期刊Electrochemical and Solid-State Letters
7
1
DOI
出版状态已出版 - 2004
已对外发布

指纹

探究 'Magnetically Controlled Electroplating of NiFe/Cu Composite Wires' 的科研主题。它们共同构成独一无二的指纹。

引用此