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Integration of electronics and photonics in active material by femtosecond laser for functional microdevice fabrication

  • Ya Cheng*
  • , Zhizhan Xu
  • , Koji Sugioka
  • , Katsumi Midorikawa
  • *此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Recently, hybrid integration of multifunctional micro-components for creating complex, intelligent micro/nano systems has attracted significant attention. These micro/nano systems have important applications in a variety of areas, such as healthcare, environment, communication, national security, and so on. Until now, fabrication of micro/nano systems incorporated with different functions is still a challenging issue, which generally requires fabrication of microcomponents beforehand followed by assembly and packaging procedures. Thus, the fabrication process is complex and costly. In recent years, the rapid development of femtosecond laser microfabrication technology has enabled direct fabrication and integration of multifunctional components, such as microfluidics, microoptics, micromechanics, microelectronics, etc., into a substrate. Particularly, in this talk, we show the use of femtosecond laser microfabrication for integrating microelectronics and microphotonics. Both microelectrodes and optical waveguides can be directly embedded in active materials after a femtosecond laser direct writing followed by electroless chemical plating. As examples, electric-optic (EO) modulators were fabricated in lithium niobate (LiNbO3) crystal and their functions were demonstrated.

源语言英语
主期刊名Laser-based Micro- and Nanopackaging and Assembly IV
DOI
出版状态已出版 - 2010
已对外发布
活动Laser-based Micro- and Nanopackaging and Assembly IV - San Francisco, CA, 美国
期限: 26 1月 201028 1月 2010

出版系列

姓名Proceedings of SPIE - The International Society for Optical Engineering
7585
ISSN(印刷版)0277-786X

会议

会议Laser-based Micro- and Nanopackaging and Assembly IV
国家/地区美国
San Francisco, CA
时期26/01/1028/01/10

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