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Integration of 3D microoptics and microfluidics in a glass chip using a femtosecond laser for photonic applications

  • Ya Cheng*
  • , Koji Sugioka
  • , Katsumi Midorikawa
  • *此作品的通讯作者
  • RIKEN

科研成果: 期刊稿件会议文章同行评审

摘要

We describe a 3D microprocessing for directly forming microoptics buried in a glass chip using a femtosecond (fs) laser irradiation followed by postannealing and successive chemical etching. By forming hollow internal structures with smooth surfaces inside glass, a variety of 3D microoptical components, such as micromirror, microbeam splitter, and microoptical circuit have been embedded in the glass and their optical properties were interrogated at the communication wavelength of 1550nm. The micromirror can reflected the light beam at 90 degrees by a total internal reflection with an optical loss of only 0.24dB. The 3D microoptics can then be integrated with 3D microfluidics for producing functional devices. Herein, we demonstrate the fabrication of microfluidic dye lasers and test the lasing functions. After filling the microfluidic chamber with a laser dye rhodamine 6G dissolved in ethanol and pumping the microfluidic laser by a frequency-doubled Nd:YAG laser, lasing action was confirmed by analyzing the emission spectra at different pumping powers. Furthermore, use of such a true 3D processing also enables fabrication of devices with multi-layered configuration. By serially embedding two microfluidic chambers in the glass, we built a microfluidic twin-laser which produces array of simultaneous two laser emissions using one pumping laser. The integration of 3D microoptics and microfluidics into the single glass chips opens up the possibility of automatic manufacture of hybrid devices for photonic applications.

源语言英语
文章编号53
页(从-至)247-256
页数10
期刊Proceedings of SPIE - The International Society for Optical Engineering
5627
DOI
出版状态已出版 - 2005
已对外发布
活动High-Power Lasers and Applications III - Beijing, 中国
期限: 8 11月 200411 11月 2004

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