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Influence of Gate-Drain Underlap Length on Germanium Gate-All-Around Tunneling Field-Effect-Transistors

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

In this paper, the influence of gate-drain underlap length (Lun) of germanium gate-all-around tunneling field-effect-transistors (Ge-GAA- TFETs) is investigated. Based on the TCAD simulation, the I- V and C- V characteristics of GAA- TFETs with different Lunare obtained, and the results show that ambipolar current (Iamp) and Cgd considerably decrease with the increase in Lun, whereas Cgs is independent on Lun. Moreover, the method of device circuit co-design is used to evaluate the impact of Lunon logic performance including propagation delay (tpd) and energy-delay-product (EDP). Compared with no underlap structure, the tpd reduction of 40% @VDD= 0.2 V is achieved in both inverter and two-input NAND with 10 nm underlap structure. The EDP reduction up to 67% and 66% at VDD= 0.2 V are obtained in the inverter and two-input NAND, respectively. Therefore, we can conclude that the longer Lunbenefits in mitigating both tpd and EDP.

源语言英语
主期刊名2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings
编辑Shaofeng Yu, Xiaona Zhu, Ting-Ao Tang
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781728162355
DOI
出版状态已出版 - 3 11月 2020
活动15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Virtual, Kunming, 中国
期限: 3 11月 20206 11月 2020

出版系列

姓名2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings

会议

会议15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020
国家/地区中国
Virtual, Kunming
时期3/11/206/11/20

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