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Improvement of C-shaped pocket TFET with sandwiched drain for ambipolar performance and analog/RF performance

  • Wanyang Xiao
  • , Liang Wang
  • , Yu Peng
  • , Yafei Ding
  • , Yingjie Ma
  • , Fang Yang*
  • , Weijing Liu*
  • , Zimiao Zhao
  • , Jie Xu
  • , Min Tang
  • , Wei Bai
  • , Xiaodong Tang
  • *此作品的通讯作者
  • Shanghai University of Electric Power
  • Huahong Group
  • Semiconductor Manufacturing International Corporation Shanghai

科研成果: 期刊稿件文章同行评审

摘要

A novel structure of tunneling field effect transistor device (CSP-SD-TFET) is proposed, which adds a sandwiched drain to the C-shaped pocket TFET (CSP-TFET). This structure can increase the resistance of the drain, share the lateral electric field at the tunneling junction between the channel and the drain, reduce the lateral electric field at the tunneling junction, and suppress the generation of ambipolar current. The DC and analog/RF characteristics of CSP-SD-TFET are simulated and analyzed by Sentaurus TCAD, and the sandwiched structure parameters of the drain are optimized. The results show that the sandwiched drain structure suppresses the ambipolar current and on-state current, so the parameters of the sandwiched drain structure need to be a compromise between low ambipolar current and high on-state current. The optimized CSP-SD-TFET device has good DC characteristics, such as low average subthreshold swing SSavg (12.2mV/dec), high on/off current ratio Ion/Ioff (2.5 × 1011), high on-state current Ion (9.02 × 10−4 A/μm) and low ambipolar current Iamb (5.41 × 10−17A/μm). The RF performance of the CSP-SD-TFET, such as the cut-off frequency fT (1 × 1011 Hz) and gain-bandwidth product GBP (5.66 × 1010 Hz), are improved. It can be seen that the CSP-SD-TFET device not only has good DC characteristics but also improves analog/RF characteristics.

源语言英语
文章编号106211
期刊Microelectronics Journal
148
DOI
出版状态已出版 - 6月 2024

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