Improved heat-dissipating silicone by nano-materials for LED packaging

M. L. Cao; F. Y. Pang; M. C. Zhang; Z. J. Cheng; Y. Gao; P. G. He; L. K. Pan; Z. Sun

doi:10.1109/INEC.2008.4585595

Improved heat-dissipating silicone by nano-materials for LED packaging

M. L. Cao
, F. Y. Pang
, M. C. Zhang
, Z. J. Cheng
, Y. Gao
, P. G. He
, L. K. Pan
, Z. Sun

East China Normal University

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

9 引用（Scopus）

摘要

Nano-diamond particles with the size of 5nm were dispersed into silicone materials to form diamond/silicone nano-composite films. The films were characterized with scanning electron microscopy, UV-Visible optical transmittance spectroscopy, and Hot Disk thermal constant analysis instrument. The results showed that the thermal conductivity of silicone was enhanced twice without much sacrifice of transmittance when silicone was doped with 0.02% nano-diamond particles.

源语言	英语
主期刊名	2008 2nd IEEE International Nanoelectronics Conference, INEC 2008
页	758-760
页数	3
DOI	https://doi.org/10.1109/INEC.2008.4585595
出版状态	已出版 - 2008
已对外发布	是
活动	2008 2nd IEEE International Nanoelectronics Conference, INEC 2008 - Shanghai, 中国期限: 24 3月 2008 → 27 3月 2008

出版系列

姓名	2008 2nd IEEE International Nanoelectronics Conference, INEC 2008

会议

会议	2008 2nd IEEE International Nanoelectronics Conference, INEC 2008
国家/地区	中国
市	Shanghai
时期	24/03/08 → 27/03/08

访问文件

10.1109/INEC.2008.4585595

其它文件与链接

链接到 Scopus 的出版物

引用此

Cao, M. L., Pang, F. Y., Zhang, M. C., Cheng, Z. J., Gao, Y., He, P. G., Pan, L. K., & Sun, Z. (2008). Improved heat-dissipating silicone by nano-materials for LED packaging. 在 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008 (页码 758-760). 文章 4585595 (2008 2nd IEEE International Nanoelectronics Conference, INEC 2008). https://doi.org/10.1109/INEC.2008.4585595

@inproceedings{fb7d22e95d2d482e93c6f291374b8c7a,

title = "Improved heat-dissipating silicone by nano-materials for LED packaging",

abstract = "Nano-diamond particles with the size of 5nm were dispersed into silicone materials to form diamond/silicone nano-composite films. The films were characterized with scanning electron microscopy, UV-Visible optical transmittance spectroscopy, and Hot Disk thermal constant analysis instrument. The results showed that the thermal conductivity of silicone was enhanced twice without much sacrifice of transmittance when silicone was doped with 0.02\% nano-diamond particles.",

keywords = "LED packaging, Nano-diamond, Thermal conductivity",

author = "Cao, \{M. L.\} and Pang, \{F. Y.\} and Zhang, \{M. C.\} and Cheng, \{Z. J.\} and Y. Gao and He, \{P. G.\} and Pan, \{L. K.\} and Z. Sun",

year = "2008",

doi = "10.1109/INEC.2008.4585595",

language = "英语",

isbn = "9781424415731",

series = "2008 2nd IEEE International Nanoelectronics Conference, INEC 2008",

pages = "758--760",

booktitle = "2008 2nd IEEE International Nanoelectronics Conference, INEC 2008",

note = "2008 2nd IEEE International Nanoelectronics Conference, INEC 2008 ; Conference date: 24-03-2008 Through 27-03-2008",

}

Cao, ML, Pang, FY, Zhang, MC, Cheng, ZJ, Gao, Y, He, PG, Pan, LK & Sun, Z 2008, Improved heat-dissipating silicone by nano-materials for LED packaging. 在 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008., 4585595, 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008, 页码 758-760, 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008, Shanghai, 中国, 24/03/08. https://doi.org/10.1109/INEC.2008.4585595

TY - GEN

T1 - Improved heat-dissipating silicone by nano-materials for LED packaging

AU - Cao, M. L.

AU - Pang, F. Y.

AU - Zhang, M. C.

AU - Cheng, Z. J.

AU - Gao, Y.

AU - He, P. G.

AU - Pan, L. K.

AU - Sun, Z.

PY - 2008

Y1 - 2008

N2 - Nano-diamond particles with the size of 5nm were dispersed into silicone materials to form diamond/silicone nano-composite films. The films were characterized with scanning electron microscopy, UV-Visible optical transmittance spectroscopy, and Hot Disk thermal constant analysis instrument. The results showed that the thermal conductivity of silicone was enhanced twice without much sacrifice of transmittance when silicone was doped with 0.02% nano-diamond particles.

AB - Nano-diamond particles with the size of 5nm were dispersed into silicone materials to form diamond/silicone nano-composite films. The films were characterized with scanning electron microscopy, UV-Visible optical transmittance spectroscopy, and Hot Disk thermal constant analysis instrument. The results showed that the thermal conductivity of silicone was enhanced twice without much sacrifice of transmittance when silicone was doped with 0.02% nano-diamond particles.

KW - LED packaging

KW - Nano-diamond

KW - Thermal conductivity

UR - https://www.scopus.com/pages/publications/52649130368

U2 - 10.1109/INEC.2008.4585595

DO - 10.1109/INEC.2008.4585595

M3 - 会议稿件

AN - SCOPUS:52649130368

SN - 9781424415731

T3 - 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008

SP - 758

EP - 760

BT - 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008

T2 - 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008

Y2 - 24 March 2008 through 27 March 2008

ER -

Improved heat-dissipating silicone by nano-materials for LED packaging

摘要

出版系列

会议

访问文件

其它文件与链接

学术指纹

引用此