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High-performance transparent conductive film by using ultra-thin metal grids

  • Zhiqin Yin
  • , Qingquan Liu
  • , Zhuangzhuang Cui
  • , Zhiyi Xuan
  • , Maobing Xie
  • , Bimu Yao
  • , Shaowei Wang*
  • *此作品的通讯作者
  • CAS - Shanghai Institute of Technical Physics
  • Shanghai Research Center for Quantum Sciences
  • Shanghai Engineering Research Center of Energy-Saving Coatings
  • University of Chinese Academy of Sciences
  • ShanghaiTech University

科研成果: 期刊稿件 › 文章 › 同行评审

摘要

Transparent conductive films (TCFs) are indispensable for many optoelectronic devices. Films with high transmittance and low sheet resistance at low cost are ideal for people to pursue. In this paper, ultra-thin Au grid TCFs with thickness less than 0.32 μm are developed and fabricated by ultraviolet lithography. Nanoscale thick metal grid and simple experimental steps can greatly reduce their cost. The influence of grid shape (square, hexagon, ring), thickness and duty ratio on the transmittance and sheet resistance has been investigated systematically. The TCF with square shape Au grid has excellent properties with transmittance of 96.9%, sheet resistance of 11.5 ω sq-1, and corresponding figure of merit of 1016. It is a good transparent heater with heating speed 100% faster and heating temperature 3.3% higher than indium tin oxide. It can also be fabricated on flexible substrates and exhibit good mechanical property, which have wide practical applications.

源语言英语
期刊论文编号035016
期刊Semiconductor Science and Technology
卷37
期3
DOI
出版状态已出版 - 3月 2022
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