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Femtosecond laser fabrication of lab-on-a-chip in glass for enhancing detection sensitivity

  • Y. Cheng
  • , Tracy E. Hockenhull
  • , H. L. Tsai*
  • *此作品的通讯作者
  • Missouri University of Science and Technology

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Lab-on-a-chip devices offer faster, cheaper, and better ways of doing chemical and biological analyses. In this paper, we will show that both 3D micro-fluidic and 3D micro-optical structures can be directly formed in photosensitive glass using a femtosecond laser and an annealing and etching process. Particularly, we will demonstrate the fabrication and examine the function of lab-on-a-chip biosensors integrated with micro-optical loops for enhancing detection sensitivity. The fabricated lab-on-a-chip biosensors are composed of a micro-fluidic channel into which sample under test will be injected. Five micro-optical mirrors are distributed on both sides of the micro-channel to form a zigzag optical path, which forces a micro-optical beam to cross the micro-fluidic channel three times before entering into a photodetector. This design can effectively extend the absorption path length and result in enhanced detection sensitivity of photoabsorption spectroscopic analysis. To examine the function of the micro-device, we filled the microfluidic channel with a dye solution (Rhodamine 640 dissolved in methanol) and shone a green laser beam (532nm) from a laser pointer into the microstructure. The fluorescence emission from the dye solution indicated that the light beam passed through the microchannel; however, due to the strong absorption, the output beam was not obvious. Quantitative characterization is under way for evaluating the detection limit of the labon-a-chip micro-device.

源语言英语
主期刊名Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Heat Transfer
出版商American Society of Mechanical Engineers (ASME)
ISBN(印刷版)0791837904, 9780791837900
出版状态已出版 - 2006
已对外发布
活动2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Chicago, IL, 美国
期限: 5 11月 200610 11月 2006

出版系列

姓名American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
ISSN(印刷版)0272-5673

会议

会议2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006
国家/地区美国
Chicago, IL
时期5/11/0610/11/06

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