跳到主要导航 跳到搜索 跳到主要内容

Electronegativity equalization model for interface barrier formation at reactive metal/organic contacts

  • J. X. Tang
  • , Y. Q. Li
  • , S. D. Wang
  • , C. S. Lee
  • , S. T. Lee
  • Soochow University
  • City University of Hong Kong

科研成果: 期刊稿件文章同行评审

摘要

A general model based on electronegativity equalization method (EEM) is proposed for a quantitative formulation of barrier formation at reactive metal/organic interfaces. The present model predicts for molecular bonding formation a linear dependence of barrier heights on the degree of partial charge transfer, which is determined by the electronegativity difference between metals and molecules. Also, the calculated barrier heights show good agreement with the empirical values. It suggests that the EEM-based electronegativity model has captured the essence of barrier formation at reactive metal/organic interfaces, and that electronegativity is a fundamental factor in characterizing the chemical trend of barrier heights.

源语言英语
期刊论文编号173303
期刊Applied Physics Letters
95
17
DOI
出版状态已出版 - 2009
已对外发布

学术指纹

探究 'Electronegativity equalization model for interface barrier formation at reactive metal/organic contacts' 的科研主题。它们共同构成独一无二的学术指纹。

引用此