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Design Technology Co-Optimization for 3 nm Gate-All-Around Nanosheet FETs

  • Meng Wang
  • , Yabin Sun*
  • , Xiaojin Li
  • , Yanling Shi
  • , Shaojian Hu
  • , Enming Shang
  • , Shoumian Chen
  • *此作品的通讯作者
  • East China Normal University
  • Integrated Circuit Research and Development Center

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

In this work, an improved TCAD based Design Technology Co-Optimization (DTCO) is proposed for gate-All-Around (GAA) Nanosheet FET (NSFET) at 3 nm technology node. Based on conventional DTCO, only an additional procedure is introduced to extract the SPICE model, while the huge computational expense in the TCAD simulation is saved. Compared to the 5 nm technology node, the performance of ring oscillator (RO) in the optimized 3 nm technology node increases by 30%, while the power decreases by 56%. Besides, dual-k spacer design for NSFETs at the device and circuit levels are also investigated.

源语言英语
主期刊名2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings
编辑Shaofeng Yu, Xiaona Zhu, Ting-Ao Tang
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781728162355
DOI
出版状态已出版 - 3 11月 2020
活动15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Virtual, Kunming, 中国
期限: 3 11月 20206 11月 2020

出版系列

姓名2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings

会议

会议15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020
国家/地区中国
Virtual, Kunming
时期3/11/206/11/20

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