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Denoising of Transmission Electron Microscopy Images for Atomic Defect Identification

  • Shiyi Zhang
  • , Qing Zhang
  • , Xu Ran
  • , Xing Wu
  • , Yan Wang*
  • , Chaolun Wang*
  • *此作品的通讯作者
  • East China Normal University

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

摘要

Two-dimensional (2D) materials possess remarkable electrical, mechanical, thermal, and optical properties, making them applicable in the fields of electronics and optoelectronics. Atomic defects could significantly affect device performance and reliability. Clearly identify and analysis of atomic defects in 2D materials is crucial. Transmission electron microscopy (TEM) with atomic resolution serves as an ideal method for the defect characterization of 2D materials. However, TEM images often suffer from various types of noise, which severely hampers the analysis of 2D materials. In this study, we propose a neural network based on the optimized CycleGAN architecture for TEM image denoising even when obtaining strictly paired datasets for TEM is challenging. The optimized CycleGAN model with attention gate could improve the signal-to-noise ratio and structural similarity of the denoised images. The effectiveness of this method was validated on the scanning transmission electron microscopy image dataset. Enhancing the visibility of atomic contrast and improving the accuracy of identifying individual atomic structures are achieved by removing the surrounding noise from the original image.

源语言英语
主期刊名2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9798350360608
DOI
出版状态已出版 - 2024
活动2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024 - Singapore, 新加坡
期限: 15 7月 2024 → 18 7月 2024

丛书

姓名Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
ISSN(印刷版)1946-1542
ISSN(电子版)1946-1550

会议

会议2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024
国家/地区新加坡
市Singapore
时期15/07/24 → 18/07/24

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