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Deep Learning for Analysis of Two-Dimensional Materials in High-Resolution Transmission Electron Microscopy Image

  • Zhiwei Sheng
  • , Jing Xie
  • , Shiyi Zhang
  • , Mingyang Zhang
  • , Chen Luo
  • , Zuoyuan Dong
  • , Yan Wang*
  • , Xing Wu*
  • , Chaolun Wang
  • *此作品的通讯作者
  • East China Normal University

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Two-dimensional (2D) materials possess exceptional electrical, mechanical, thermal, and optical properties, making them widely applicable in fields of electronics, energy, optoelectronics, and medicine. The geometry of 2D materials at the nanoscale, such as the number of layers, interlayer spacing, and thickness of the layers are of particular interest, as they have great influence to the properties of the material. Transmission electron microscopy (TEM) with atomic resolution is an ideal research method for 2D materials. However, analyzing the properties of 2D materials by interpreting the high-resolution TEM images not only require rich expertise but also is a time-consuming and labor-intensive task. In this work, we propose a neural network based on the U-Net architecture for high efficiency TEM image analysis of the geometry of 2D materials. The effectiveness of this method is verified on MoS2 image datasets and obtained dice coefficients of 0.92. The physical parameters such as layer number, thickness, and interlayer spacing information of 2D materials can be analyzed subsequently. Our results provide an artificial intelligent approach to analyze 2D materials.

源语言英语
主期刊名2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9798350301649
DOI
出版状态已出版 - 2023
活动2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 - Pulau Pinang, 马来西亚
期限: 24 7月 202327 7月 2023

出版系列

姓名Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
2023-July

会议

会议2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
国家/地区马来西亚
Pulau Pinang
时期24/07/2327/07/23

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