Atomic insight into the BEOL thermal budget on phase transition of phase change memory cells

Research works on phase change random access memory (PCRAM) based on Ge-Sb-Te (GST) phase change materials have achieved exciting progress, but the industrialization of PCRAM still faces big challenges, including unsatisfied endurance property or unexpected cell structure failure during fabrication. Here, we investigate the impact of the thermal budget in back-end-of-line (BEOL) process on the microstructure evolution of carbon doped GST (CGST) cells. We demonstrate that the as-deposited amorphous CGST in the confined memory cell will transform to face centered-cubic (FCC) phase with uniform grain size during high temperature up to 400 °C in the BEOL process. However, if there is much more unexpected thermal budget during the BEOL process, the FCC-CGST grains will further grow and transform to highly ⟨0001⟩ oriented single crystalline hexagonal (HEX) GST, together with the formation of voids, leading to the structure failure of the storage cells. By virtue of the advanced spherical aberration corrected transmission electron microscopy (Cs-TEM), we find that there are randomly stacked seven-layered and nine-layered atomic arrangements in single crystalline HEX-GST, corresponding to the chemical stoichiometry of Ge₂Sb₂Te₅ and Ge₁Sb₂Te₄, respectively. Interestingly, twin crystal with the coexistence of vacancy-ordered FCC-GST and HEX-GST on the different twin boundary is observed, indicating that the twin crystals play a critical role in the coalescence and the growth of FCC-GST. This work not only sheds light on the structure failure mechanism of GST cell but also provided additional insight into the formation of HEX-phase in a confined GST memory cell.