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An efficient technique for chip temperature optimization of multiprocessor systems in the dark silicon era

  • Mengquan Li
  • , Juan Yi
  • , Weichen Liu*
  • , Wei Zhang
  • , Lei Yang
  • , Edwin H.M. Sha
  • *此作品的通讯作者
  • Chongqing University
  • Hong Kong University of Science and Technology

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

In the dark silicon era, a fundamental problem is: given a real-time computation demand represented by a set of independent applications with their own power consumption, how to determine if an on-chip multiprocessor system is able to respond to this demand and maintain its reliability by keeping every core within the safe temperature range. In this paper, we first present a novel thermal model for the prediction of chip peak temperature assuming the application-to-core mapping is determined. The mathematical model combines linearized steady-state thermal model with empirical scaling factors to achieve significantly improved accuracy and running efficiency. Based on it, a MILP-based approach is presented to find the optimal application-to-core assignment such that the computation demand is met and the chip temperature is minimized. At last, if the minimized temperature still exceeds the safe temperature threshold, a novel heuristic algorithm, called temperature threshold-aware result handling (TTRH), is proposed to drop certain applications selectively from immediate execution, and lower the chip peak temperature to the safety threshold. Extensive performance evaluation shows that the MILP-based approach can reduce the chip peak temperature by 9.1 C on average compared to traditional techniques. TTRH algorithm can further lower the chip peak temperature by 1.38° C on average with the application dropping rate of less than 4.35%.

源语言英语
主期刊名Proceedings - 2015 IEEE 17th International Conference on High Performance Computing and Communications, 2015 IEEE 7th International Symposium on Cyberspace Safety and Security and 2015 IEEE 12th International Conference on Embedded Software and Systems, HPCC-CSS-ICESS 2015
出版商Institute of Electrical and Electronics Engineers Inc.
688-693
页数6
ISBN(电子版)9781479989362
DOI
出版状态已出版 - 23 11月 2015
已对外发布
活动17th IEEE International Conference on High Performance Computing and Communications, IEEE 7th International Symposium on Cyberspace Safety and Security and IEEE 12th International Conference on Embedded Software and Systems, HPCC-ICESS-CSS 2015 - New York, 美国
期限: 24 8月 201526 8月 2015

出版系列

姓名Proceedings - 2015 IEEE 17th International Conference on High Performance Computing and Communications, 2015 IEEE 7th International Symposium on Cyberspace Safety and Security and 2015 IEEE 12th International Conference on Embedded Software and Systems, HPCC-CSS-ICESS 2015

会议

会议17th IEEE International Conference on High Performance Computing and Communications, IEEE 7th International Symposium on Cyberspace Safety and Security and IEEE 12th International Conference on Embedded Software and Systems, HPCC-ICESS-CSS 2015
国家/地区美国
New York
时期24/08/1526/08/15

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