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"all-in-One" chip fabrication by 3D femtosecond laser microprocessing for biophotonics

  • K. Sugioka*
  • , Y. Cheng
  • , K. Midorikawa
  • *此作品的通讯作者
  • RIKEN

科研成果: 期刊稿件文章同行评审

摘要

We developed a novel technique fabricating 3D hollow microstructures embedded in photosensitive glass. The fabrication procedure consists of the following three steps: (1) femtosecond laser direct writing, (2) thermal treatment, and (3) wet etching in a diluted HF solution. The developed technique can fabricate various microcomponents such as microfluidics, microvalve, micromirror, microsplitter, freestanding fibre, and microfluidic laser. In this paper, integration of these microcomponents in a single glass chip by a single procedure is demonstrated for all-in-one lab-on-a-chip device manufacture.

源语言英语
文章编号114
页(从-至)533-538
页数6
期刊Journal of Physics: Conference Series
59
1
DOI
出版状态已出版 - 1 4月 2007
已对外发布

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