TY - GEN
T1 - A printable metallic ink containing biphasic alloys for highly-reliable stretchable circuits
AU - Yu, Zhe
AU - Luo, Yiwen
AU - Shen, Junhao
AU - Gao, Xin
AU - Shang, Jie
AU - Wu, Xing
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Liquid metals are ideal materials for fabricating stretchable circuits in wearable devices, becoming printable metallic inks with high conductivity by blending with solid nanoparticles. However, challenges related to reliability arise, including variation of printing patterns, and electrical damage during repeated stretching. Here, we report a novel metallic ink containing biphasic alloys, obtained by annealing the liquid metal-based mixture. The solid-phasic alloy adheres to the surface of nanoparticles, creating an anchoring effect with liquid-phasic alloy to enhance the reliability of stretchable circuits based on this novel printable metallic ink.
AB - Liquid metals are ideal materials for fabricating stretchable circuits in wearable devices, becoming printable metallic inks with high conductivity by blending with solid nanoparticles. However, challenges related to reliability arise, including variation of printing patterns, and electrical damage during repeated stretching. Here, we report a novel metallic ink containing biphasic alloys, obtained by annealing the liquid metal-based mixture. The solid-phasic alloy adheres to the surface of nanoparticles, creating an anchoring effect with liquid-phasic alloy to enhance the reliability of stretchable circuits based on this novel printable metallic ink.
KW - biphasic alloy
KW - liquid metal
KW - printable metallic ink
KW - reliability
KW - stretchable circuits
UR - https://www.scopus.com/pages/publications/85206575966
U2 - 10.1109/IPFA61654.2024.10690908
DO - 10.1109/IPFA61654.2024.10690908
M3 - 会议稿件
AN - SCOPUS:85206575966
T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
BT - 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024
Y2 - 15 July 2024 through 18 July 2024
ER -