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A novel fabrication approach for microneedles using silicon micromaching technology

  • Xiao Wang
  • , Xiaoming Chen
  • , Zhenyin Yu
  • , Lianwei Wang*
  • *此作品的通讯作者
  • East China Normal University
  • State Key Laboratory of Transducer Technology
  • IEEE

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Optimization of drug delivery through human skin is important in modern therapy, and with the invention of painless microneedles makes it become true. This paper presents a novel fabrication process for a tapered hollow metallic needles array using nickel plating on the silicon microneedles molds. The silicon microneedles molds, with a shank height of 150-200μm and 300μm center-to-center spacing are formed, using KOH etching on Si〈100〉 wafer, and the etching rate can be easily controlled around 0.5μm/min. The finale shapes of the bottom of microneedls are regular octagon. Then through the way of nickel electroplating on the silicon microneedles, the metallic needles can be fabricated. The closed tips of needles are opened by using some mechanism polishing methods. The delivery properties of the microneedles are under investigation.

源语言英语
主期刊名Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS
545-549
页数5
DOI
出版状态已出版 - 2006
活动1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS - Zhuhai, 中国
期限: 18 1月 200621 1月 2006

出版系列

姓名Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS

会议

会议1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS
国家/地区中国
Zhuhai
时期18/01/0621/01/06

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