TY - GEN
T1 - A MEMS accelerometer with double-sided symmetrical folded-beams on single wafer
AU - Li, Wei
AU - Zhou, Xiaofeng
AU - Wu, Jian
AU - Lin, Youling
AU - Wang, Ze
AU - Che, Lu Feng
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/8/25
Y1 - 2017/8/25
N2 - We present a novel MEMS capacitance accelerometer with single wafer symmetrical double-sided folded-beams structure. The highly symmetrical 8 folded-beams on single wafer is designed and fabricated by Deep Reactive Ion Etch (DRIE) and KOH wet etching from both sides of the silicon wafer. The sandwich differential capacitive accelerometer is formed by three-layer silicon-silicon bonding. The excellent performance is obtained by double-sided symmetrical folded-beams structure. The resonance frequency and quality factor are 1.3 kHz and 10, respectively. The sensitivity with closed loop interface circuit is 1.0 V/g, and the nonlinearity is 0.05% over the typical range of 1 g. The bias stability of the fabricated accelerometer is 0.2 mg.
AB - We present a novel MEMS capacitance accelerometer with single wafer symmetrical double-sided folded-beams structure. The highly symmetrical 8 folded-beams on single wafer is designed and fabricated by Deep Reactive Ion Etch (DRIE) and KOH wet etching from both sides of the silicon wafer. The sandwich differential capacitive accelerometer is formed by three-layer silicon-silicon bonding. The excellent performance is obtained by double-sided symmetrical folded-beams structure. The resonance frequency and quality factor are 1.3 kHz and 10, respectively. The sensitivity with closed loop interface circuit is 1.0 V/g, and the nonlinearity is 0.05% over the typical range of 1 g. The bias stability of the fabricated accelerometer is 0.2 mg.
KW - capacitive accelerometer
KW - folded-beams on single wafer
KW - silicon-silicon bonding
KW - symmetrical structure
UR - https://www.scopus.com/pages/publications/85030857275
U2 - 10.1109/NEMS.2017.8017004
DO - 10.1109/NEMS.2017.8017004
M3 - 会议稿件
AN - SCOPUS:85030857275
T3 - 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
SP - 194
EP - 197
BT - 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017
Y2 - 9 April 2017 through 12 April 2017
ER -