TY - GEN
T1 - 22.6 A 13-Channel 1.53-mW 11.28-mm2 Electrical Impedance Tomography SoC Based on Frequency Division Multiplexing with 10× Throughput Reduction
AU - Liu, Boxiao
AU - Wang, Guoxing
AU - Li, Yongfu
AU - Li, Hui
AU - Gao, Yue
AU - Zeng, Lei
AU - Ma, Yixin
AU - Lian, Yong
AU - Heng, Chun Huat
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/3/6
Y1 - 2019/3/6
N2 - Electrical-impedance tomography (EIT) has been reported as the only viable wearable real-time method for lung imaging [1]. Previous EIT chips generally employ Time-Division Multiplexing (TDM) or as active electrode to facilitate multi-channel read-out [2]-[4], and support a large number of electrodes by sharing a maximum of 6 parallel readout channels per chip. In this paper, we present an EIT-SoC with the following features: 1) early demodulation to relax the bandwidth requirement of the analog front-end, and minimize the impact of motion artifact and DC offset generated at the skin-electrode interface; 2) Frequency-Division Multiplexing (FDM) to combine 13 pairs of I/Q signals into 2 data streams for quantization by 2 δ σ Modulators (DSMs); 3) throughput reduction at a compression ratio of 9.75:1; 4) an inverted 'V-shape' gain configuration to minimize voltage variations across all channels; and 5) batch spectrum processing for data from all channels with no digital filtering.
AB - Electrical-impedance tomography (EIT) has been reported as the only viable wearable real-time method for lung imaging [1]. Previous EIT chips generally employ Time-Division Multiplexing (TDM) or as active electrode to facilitate multi-channel read-out [2]-[4], and support a large number of electrodes by sharing a maximum of 6 parallel readout channels per chip. In this paper, we present an EIT-SoC with the following features: 1) early demodulation to relax the bandwidth requirement of the analog front-end, and minimize the impact of motion artifact and DC offset generated at the skin-electrode interface; 2) Frequency-Division Multiplexing (FDM) to combine 13 pairs of I/Q signals into 2 data streams for quantization by 2 δ σ Modulators (DSMs); 3) throughput reduction at a compression ratio of 9.75:1; 4) an inverted 'V-shape' gain configuration to minimize voltage variations across all channels; and 5) batch spectrum processing for data from all channels with no digital filtering.
UR - https://www.scopus.com/pages/publications/85063512408
U2 - 10.1109/ISSCC.2019.8662352
DO - 10.1109/ISSCC.2019.8662352
M3 - 会议稿件
AN - SCOPUS:85063512408
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 370
EP - 372
BT - 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
Y2 - 17 February 2019 through 21 February 2019
ER -