指纹
深入其中 Jiongyou Jin 为活跃的研究主题。这些主题标签来自此人的成果。它们共同形成唯一的指纹。
- 1 相似简介
-
Intra-metal leakage reliability characteristics for line/via in copper/low-k interconnect structures
Kim, J. W., Lee, N. H., Kim, H. W., Kim, H. S. & Rim, C. B., 2002, 2002 IEEE International Integrated Reliability Workshop Final Report, IRW 2002. Institute of Electrical and Electronics Engineers Inc., 页码 36-40 5 页码 1194229. (IEEE International Integrated Reliability Workshop Final Report; 卷 2002-January).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
2 !!Link opens in a new tab 引用 （Scopus） -
A robust and fast OPC approach for metal interconnects of 0.13 um logic devices
Park, J. S., Kim, D. H., Park, C. H., Kim, Y. H., Yoo, M. H., Kong, J. T., Kim, H. W. & Yoo, S. I., 2001, 在: Proceedings of SPIE - The International Society for Optical Engineering. 4562 II, 页码 1104-1111 8 页码科研成果: 期刊稿件 › 会议文章 › 同行评审
6 !!Link opens in a new tab 引用 （Scopus） -
An efficient rule-based OPC approach using a DRC tool for 0.18μm ASIC
Park, J. S., Park, C. H., Rhie, S. U., Kim, Y. H., Yoo, M. H., Kong, J. T., Kim, H. W. & Yoo, S. I., 2000, Proceedings of the IEEE 2000 1st International Symposium on Quality Electronic Design, ISQED 2000. IEEE Computer Society, 页码 81-85 5 页码 838858. (Proceedings - International Symposium on Quality Electronic Design, ISQED; 卷 2000-January).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
45 !!Link opens in a new tab 引用 （Scopus）