Abstract
Three-dimensional (3D) supercapacitors consisting of Ba 0.65Sr0.35TiO3 (BST)/NiSi2/silicon microchannel plate (MCP) stacked structure have been fabricated. The silicon MCP produced by electrochemical etching is utilized as a backbone of the 3D structure on which a nickel silicide current collector layer and Ba 0.65Sr0.35TiO3 dielectric layer are deposited successively by electroless plating and the sol-gel method, respectively. The morphology and structure of the 3D BST/NiSi2/Si-MCP structure are characterized by scanning electron microscopy (SEM) and X-ray diffraction (XRD) and the electrochemical properties are determined by cyclic voltammetry (CV) and chronopotentiometry. The structure exhibits excellent capacitive behavior with a maximum capacitance of 784 F g-1. After 700 charging/discharging cycles, the Cf decreases slightly with only a 5.7% loss and is stable after more than 700 cycles. The BST/NiSi2/Si-MCP 3D structure is a potential supercapacitor in industrial applications.
| Original language | English |
|---|---|
| Pages (from-to) | 387-392 |
| Number of pages | 6 |
| Journal | Materials Science and Engineering: B |
| Volume | 176 |
| Issue number | 5 |
| DOIs | |
| State | Published - 25 Mar 2011 |
Keywords
- Electrochemical properties
- Three-dimensional supercapacitors