Thermoelectric property of different thickness ZnO films grown by gas discharge activated reaction evaporation

Haitao Sun, Chengwu Li, Hui Lu*, Bin Fang, Xian Lin, Yannan Wang, Xiaoren Pan

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

The ZnO films were deposited by gas discharge activated reaction evaporation (GDARE) on glass substrates. The impacts of the deposition conditions on its thermoelectric property were studied. The microstructures of the films were characterized with X-ray diffraction and atomic force microscopy. The results show that the film thickness strongly affects its microstructures and properties. For instance, as the thickness of the films increased, the nano-grains with size varying from 30~70 nm grew and exhibit a preferred growth orientation, along the c-axis normal to the surface. All the ZnO films have fairly high thermoelectric power; at 440 K, Seebeck coefficient, S, of a 200 nm thick ZnO films was found to be 600 μV/K. At a given temperature, its resistivity, ρ, and its Seebeck coefficient, S, decreased with an increase of the thickness. At 440 K, the 600 nm thick ZnO film possesses the best thermoelectric property. Possible mechanism was also discussed.

Original languageEnglish
Pages (from-to)292-296
Number of pages5
JournalZhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology
Volume31
Issue number3
DOIs
StatePublished - Jun 2011
Externally publishedYes

Keywords

  • Resistivity
  • Structure
  • Thermoelectric power
  • Zinc oxide thin film

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