@inproceedings{a86300a512ae4cdf85af92d9f4983ecf,
title = "Thermoelectric behavior of microchannel plates fabricated by photo-assisted electrochemical etching",
abstract = "We demonstrate the favorable thermoelectric properties of silicon microchannel plates prepared by photo-assisted electrochemical etching (PAECE). The microchannels have a square lattice distribution. The lateral Seebeck coefficient is related to the orientation and is 186 μV/K along the edge of the square and 204 μV/K when the measurement is performed at 45° with respect to the edge. The Seebeck coefficient in the vertical direction is about one sixth of the lateral value. In order to investigate whether the photonic crystal properties of the silicon microchannels have any influence on the Seebeck coefficient, both microchannel plates with holes tilted 7° with respect to the vertical direction and ordinary silicon microchannel plates are tested. They exhibit a similar thermoelectric behavior. These values are comparable to the value of silicon nanowires at room temperature, making the use of microchannel plates a good alternative to nanowires for temperature sensors.",
author = "Li Sun and Fengjuan Miao and Lianwei Wang and Chu, \{Paul K.\} and Sarro, \{P. M.\}",
year = "2010",
doi = "10.1109/MEMSYS.2010.5442436",
language = "英语",
isbn = "9781424457649",
series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",
pages = "576--579",
booktitle = "MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest",
note = "23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 ; Conference date: 24-01-2010 Through 28-01-2010",
}