@inproceedings{c6e1cae792d2415cae90288f9843a299,
title = "Thermally Induced Voids and Delamination in Cu RDL: Experimental and Simulation Study",
abstract = "This work addresses the thermal reliability of multilayer copper (Cu) redistribution layers (RDLs). Scanning electron microscopy (SEM) and energy-dispersive spectroscopy (EDS) analyses were employed to investigate the morphology and elemental distribution of Cu interconnects and polyimide (PI) layers, as well as to observe void formation and interfacial delamination under multi-stage thermal loading. Stress simulation of the RDL structure reveals significantly higher stress in Cu regions than in PI, closely linked to void nucleation and interfacial failure. The findings highlight thermal stress mismatch and local stress concentration as key drivers of degradation, providing valuable insights for assessing the reliability of high-density RDL and optimizing integrated circuit (IC) packaging.",
author = "Peng Xu and Lan Li and Yu Yao and Weikai Shi and Jiang Xia and Zongyi Li and Zuoyuan Dong and Xing Wu",
note = "Publisher Copyright: {\textcopyright} 2026 IEEE.; 2026 Conference of Science and Technology of Integrated Circuits, CSTIC 2026 ; Conference date: 22-03-2026 Through 24-03-2026",
year = "2026",
doi = "10.1109/CSTIC68613.2026.11537498",
language = "英语",
series = "2026 Conference of Science and Technology of Integrated Circuits, CSTIC 2026",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Cor Claeys and Bin Yu and Beichao Zhang and Peng Bai and Qianqian Huang and Xiaowei Li and Liang, \{Steve X.\} and Hsiang-Lan Lung and Linyong Pang and Xinping Qu and Xiaoping Shi and Jianshi Tang and Pingqiang Zhou and Cheng Zhuo",
booktitle = "2026 Conference of Science and Technology of Integrated Circuits, CSTIC 2026",
address = "美国",
}