Thermal reliability study of graphene-based planar RRAM

  • Yin Xia
  • , Chen Luo
  • , Xin Yang
  • , Chaolun Wang*
  • , Wenzhong Bao
  • , Xing Wu
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Graphene with excellent electrical properties has a wide range of applications in electronic devices. Graphene-based planar resistance random access memory (RRAM) has received much attention due to its simple preparation methods and unique working mechanisms. However, the thermal reliability of graphene-based planar RRAM has rarely been reported. Here, we explore the reliability of the graphene-based RRAM at different temperatures, especially at high temperatures. The result shows that graphene-based planar RRAM could work in the temperature range from 100 K to 570 K.

Original languageEnglish
Title of host publication2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728161693
DOIs
StatePublished - 20 Jul 2020
Event2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020 - Singapore, Singapore
Duration: 20 Jul 202023 Jul 2020

Publication series

NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume2020-July

Conference

Conference2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2020
Country/TerritorySingapore
CitySingapore
Period20/07/2023/07/20

Keywords

  • graphene
  • resistance random access memory
  • thermal reliability
  • two-dimensional material

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