The studies of room temperature electrical resistivity of post-annealed LaNiO3-δ thin film on Si(100)/n by RF magnetron sputtering

  • X. D. Zhang*
  • , X. J. Meng
  • , J. L. Sun
  • , G. S. Wang
  • , T. Lin
  • , J. H. Chu
  • *Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

Abstract

Highly (100)-oriented LaNiO3-δ (LNO) thin film were grown on n-type Si(100) at substrate temperature 200°C with 40% oxygen partial pressure. The as-deposited LNO films are metallic and have a resistivity of ∼9 X 10-4 mΩcm at room temperature (RT) and can be used as the bottom electrode for the fabrication of integrated ferroelectric capacitors on Si. A post-annealing process can decrease the RT resistivity to ∼3×10-4 Ωcm at 700°C and yield crack at 800°C.

Original languageEnglish
Article number107
Pages (from-to)458-461
Number of pages4
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5774
DOIs
StatePublished - 2005
Externally publishedYes
EventFifth International Conference on Thin Film Physics and Applications - Shanghai, China
Duration: 31 May 20042 Jun 2004

Keywords

  • 4-point probe
  • LaNiO thin film
  • Post-annealing
  • RTA
  • rf sputtering

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