The improvement of electrochemical etching process for silicon microchannel plates

  • Ding Yuan
  • , Pengliang Ci
  • , Fei Tian
  • , Jing Shi
  • , Shaohui Xu
  • , Peisheng Xin
  • , Lianwei Wang*
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Silicon microchannel plates have been explored intensively for numerous applications especially for ultraviolet image detection. The electrochemical etching in hydrofluoric acid-based solutions is known as a technique for porous silicon formation. The function of backside illumination and temperature in the electrochemical etching of large-size and high aspect ratio silicon microchannels plates has been reported in this paper. The backside illumination was provided by a set of triple 150 W tungsten-halogen lamps with a feedback-loop which keeps the constant current density. And a circulation system was set up to maintain the etching temperature. It was found that proper backside illumination and lower temperature can form an improved etching condition in which etching may result in smoother undercut and better surface topography for large-size silicon microchannel plates.

Original languageEnglish
Title of host publication4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009
Pages964-969
Number of pages6
DOIs
StatePublished - 2009
Event4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009 - Shenzhen, China
Duration: 5 Jan 20098 Jan 2009

Publication series

Name4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009

Conference

Conference4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009
Country/TerritoryChina
CityShenzhen
Period5/01/098/01/09

Keywords

  • Backside illumination
  • Photon-ectrochemical etching
  • Silicon microchannel plates
  • Temperature
  • Undercut

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