Abstract
The ablation process in sapphire and fused silica are studied with laser at 800nm and 400nm respectively. Comparing with the features of the ablated craters induced by different laser, we find that lasers with short wavelength and pulse duration can produce more exquisite ablation crater with small area and steep gradient. By means of determining the Fth with detection of the scattered light, the developments of the threshold fluence of dielectrics as a function of pulse duration are presented. While interpreting our results with existent model of optical breakdown, we discuss the excitation mechanism of conduction band electrons (CBE) in transparent dielectrics.
| Original language | English |
|---|---|
| Pages (from-to) | 87-91 |
| Number of pages | 5 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 5063 |
| DOIs | |
| State | Published - 2003 |
| Externally published | Yes |
| Event | Fourth International Symposium on Laser Precision Microfabrication - Munich, Germany Duration: 21 Jun 2003 → 24 Jun 2003 |
Keywords
- Threshold fluence
- Transparent dielectrics
- Ultrashort pulse laser ablation