Tailored femtosecond bessel beam processing- application to through Si vias for 3d Si ICs -

  • Koji Sugioka*
  • , Fei He
  • , Ya Cheng
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Original languageEnglish
Title of host publicationJSAP-OSA Joint Symposia, JSAP 2017
PublisherOptica Publishing Group (formerly OSA)
ISBN (Electronic)9784863486416
ISBN (Print)9784863486416
StatePublished - 2017
Externally publishedYes
EventJSAP-OSA Joint Symposia, JSAP 2017 - Fukuoka, Japan
Duration: 18 Sep 201721 Sep 2017

Publication series

NameOptics InfoBase Conference Papers
VolumePart F78-JSAP 2017
ISSN (Electronic)2162-2701

Conference

ConferenceJSAP-OSA Joint Symposia, JSAP 2017
Country/TerritoryJapan
CityFukuoka
Period18/09/1721/09/17

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