Abstract
A novel cycloaliphatic triepoxide, 1,1-bis(2′,3′-epoxycyclohexyloxymethyl)-3,4-epoxycyclohexane (II), and its precursor, 1,1-bis(2′-cyclohexenyloxymethyl)-3-cyclohexene, were synthesized. Their chemical structures were confirmed with IR spectroscopy, elemental analysis, and 1H NMR spectroscopy. II was easily cured with hexahydro-4-methylphthalic anhydride with 1,3,5-triethylhexahydro-s-triazine as a curing accelerator. The physical properties of the cured product were examined with thermomechanical analysis, thermogravimetric analysis, and dynamic mechanical analysis. Compared with the commercial diepoxide ERL-4221 under the same curing conditions, the cured product based on II showed a much higher glass-transition temperature (198°C), a higher crosslinking density (2.08 × 10-3 mol/cm3), and a lower coefficient of thermal expansion [6.2 × 105(/°C)]. II may become a promising candidate material for modern microelectronic packaging.
| Original language | English |
|---|---|
| Pages (from-to) | 2799-2804 |
| Number of pages | 6 |
| Journal | Journal of Polymer Science, Part A: Polymer Chemistry |
| Volume | 39 |
| Issue number | 16 |
| DOIs | |
| State | Published - 15 Aug 2001 |
| Externally published | Yes |
Keywords
- Cycloaliphatic epoxide
- Electronic packaging
- Mechanical properties
- Synthesis
- Thermal properties
- Thermosets