Study on the Anti-Crack Propagation Behavior of a Submicron Pore-Enriched Elastomer Composite

Junhao Shen; Pengyang Han; Shaohua Zuo; Fuwen Shi; Canguan Gao; Zhe Yu; Hengchang Bi; Xing Wu

doi:10.1109/IPFA61654.2024.10691079

Study on the Anti-Crack Propagation Behavior of a Submicron Pore-Enriched Elastomer Composite

Junhao Shen, Pengyang Han, Shaohua Zuo, Fuwen Shi, Canguan Gao, Zhe Yu, Hengchang Bi, Xing Wu

School of Communication and Electronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Elastomeric materials play a pivotal role in the composition of flexible sensors and actuators, garnering significant attention within the realm of flexible electronics. However, the failure reliability problem of intrinsically isotropic elastomers due to crack propagation still exists. In this work, an elastomeric composite enriched in submicron voids was fabricated by overfilling silicone rubber with small-sized carbon black (CB) particles. Different from the intrinsic silicone rubber film, the porous carbon black/silicone rubber composite exhibits unusual anti-crack propagation behavior. The dynamic evolution of the morphology at the crack tip of the composite was observed by in situ scanning electron microscopy (SEM), revealing the anisotropic transformation mechanism caused by the strain on the composite.

Original language	English
Title of host publication	2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9798350360608
DOIs	https://doi.org/10.1109/IPFA61654.2024.10691079
State	Published - 2024
Event	2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024 - Singapore, Singapore Duration: 15 Jul 2024 → 18 Jul 2024

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
ISSN (Print)	1946-1542
ISSN (Electronic)	1946-1550

Conference

Conference	2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024
Country/Territory	Singapore
City	Singapore
Period	15/07/24 → 18/07/24

Keywords

anisotropy
anti-crack propagation
elastomeric materials

Access to Document

10.1109/IPFA61654.2024.10691079

Cite this

Shen, J., Han, P., Zuo, S., Shi, F., Gao, C., Yu, Z., Bi, H., & Wu, X. (2024). Study on the Anti-Crack Propagation Behavior of a Submicron Pore-Enriched Elastomer Composite. In 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPFA61654.2024.10691079

Shen, Junhao ; Han, Pengyang ; Zuo, Shaohua et al. / Study on the Anti-Crack Propagation Behavior of a Submicron Pore-Enriched Elastomer Composite. 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024. Institute of Electrical and Electronics Engineers Inc., 2024. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

@inproceedings{d666809654d84ed6af10300b00f7947b,

title = "Study on the Anti-Crack Propagation Behavior of a Submicron Pore-Enriched Elastomer Composite",

abstract = "Elastomeric materials play a pivotal role in the composition of flexible sensors and actuators, garnering significant attention within the realm of flexible electronics. However, the failure reliability problem of intrinsically isotropic elastomers due to crack propagation still exists. In this work, an elastomeric composite enriched in submicron voids was fabricated by overfilling silicone rubber with small-sized carbon black (CB) particles. Different from the intrinsic silicone rubber film, the porous carbon black/silicone rubber composite exhibits unusual anti-crack propagation behavior. The dynamic evolution of the morphology at the crack tip of the composite was observed by in situ scanning electron microscopy (SEM), revealing the anisotropic transformation mechanism caused by the strain on the composite.",

keywords = "anisotropy, anti-crack propagation, elastomeric materials",

author = "Junhao Shen and Pengyang Han and Shaohua Zuo and Fuwen Shi and Canguan Gao and Zhe Yu and Hengchang Bi and Xing Wu",

note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024 ; Conference date: 15-07-2024 Through 18-07-2024",

year = "2024",

doi = "10.1109/IPFA61654.2024.10691079",

language = "英语",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024",

address = "美国",

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Shen, J, Han, P, Zuo, S, Shi, F, Gao, C, Yu, Z, Bi, H & Wu, X 2024, Study on the Anti-Crack Propagation Behavior of a Submicron Pore-Enriched Elastomer Composite. in 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Institute of Electrical and Electronics Engineers Inc., 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024, Singapore, Singapore, 15/07/24. https://doi.org/10.1109/IPFA61654.2024.10691079

Study on the Anti-Crack Propagation Behavior of a Submicron Pore-Enriched Elastomer Composite. / Shen, Junhao; Han, Pengyang; Zuo, Shaohua et al.
2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024. Institute of Electrical and Electronics Engineers Inc., 2024. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - Study on the Anti-Crack Propagation Behavior of a Submicron Pore-Enriched Elastomer Composite

AU - Shen, Junhao

AU - Han, Pengyang

AU - Zuo, Shaohua

AU - Shi, Fuwen

AU - Gao, Canguan

AU - Yu, Zhe

AU - Bi, Hengchang

AU - Wu, Xing

PY - 2024

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N2 - Elastomeric materials play a pivotal role in the composition of flexible sensors and actuators, garnering significant attention within the realm of flexible electronics. However, the failure reliability problem of intrinsically isotropic elastomers due to crack propagation still exists. In this work, an elastomeric composite enriched in submicron voids was fabricated by overfilling silicone rubber with small-sized carbon black (CB) particles. Different from the intrinsic silicone rubber film, the porous carbon black/silicone rubber composite exhibits unusual anti-crack propagation behavior. The dynamic evolution of the morphology at the crack tip of the composite was observed by in situ scanning electron microscopy (SEM), revealing the anisotropic transformation mechanism caused by the strain on the composite.

AB - Elastomeric materials play a pivotal role in the composition of flexible sensors and actuators, garnering significant attention within the realm of flexible electronics. However, the failure reliability problem of intrinsically isotropic elastomers due to crack propagation still exists. In this work, an elastomeric composite enriched in submicron voids was fabricated by overfilling silicone rubber with small-sized carbon black (CB) particles. Different from the intrinsic silicone rubber film, the porous carbon black/silicone rubber composite exhibits unusual anti-crack propagation behavior. The dynamic evolution of the morphology at the crack tip of the composite was observed by in situ scanning electron microscopy (SEM), revealing the anisotropic transformation mechanism caused by the strain on the composite.

KW - anisotropy

KW - anti-crack propagation

KW - elastomeric materials

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Shen J, Han P, Zuo S, Shi F, Gao C, Yu Z et al. Study on the Anti-Crack Propagation Behavior of a Submicron Pore-Enriched Elastomer Composite. In 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024. Institute of Electrical and Electronics Engineers Inc. 2024. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA61654.2024.10691079

Study on the Anti-Crack Propagation Behavior of a Submicron Pore-Enriched Elastomer Composite

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