Strain-Invariant Conductors from Liquid Metal and Silver Microsheets

Junhao Shen; Jiajie Cui; Zewen Gan; Shaohua Zuo; Fuwen Shi; Tao Wang; Hengchang Bi; Xing Wu

doi:10.1109/IPFA65338.2025.11256712

Strain-Invariant Conductors from Liquid Metal and Silver Microsheets

Junhao Shen
, Jiajie Cui
, Zewen Gan
, Shaohua Zuo
, Fuwen Shi
, Tao Wang
, Hengchang Bi
, Xing Wu^*

^*Corresponding author for this work

School of Communication and Electronic Engineering

East China Normal University
East China University of Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Flexible and stretchable metal conductors are essential for next-generation wearable electronics. However, ensuring their electrical stability under extreme tensile deformations poses a significant challenge. In this study, silver sheets (AgMS), arranged in a planar configuration, are deposited onto the surface of liquid metal (LM), specifically the eutectic gallium-indium alloy (EGaIn), using the Langmuir-Blodgett (LB) technique. Due to the strain-insensitive electron transport mechanism between the two materials, the LMI AgMS flexible wires maintain nearly unchanged electrical performance under extreme strain (300%, R/Ro = 2.07), presenting a novel strategy for designing strain-insensitive stretchable wires.

Original language	English
Title of host publication	2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9798331549428
DOIs	https://doi.org/10.1109/IPFA65338.2025.11256712
State	Published - 2025
Event	32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025 - Bayan Lepas, Malaysia Duration: 5 Aug 2025 → 8 Aug 2025

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
ISSN (Print)	1946-1542
ISSN (Electronic)	1946-1550

Conference

Conference	32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025
Country/Territory	Malaysia
City	Bayan Lepas
Period	5/08/25 → 8/08/25

Keywords

failure analysis
Langmuir-Blodgett
reliability
stretchable wire

Access to Document

10.1109/IPFA65338.2025.11256712

Cite this

Shen, J., Cui, J., Gan, Z., Zuo, S., Shi, F., Wang, T., Bi, H., & Wu, X. (2025). Strain-Invariant Conductors from Liquid Metal and Silver Microsheets. In 2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPFA65338.2025.11256712

Shen, Junhao ; Cui, Jiajie ; Gan, Zewen et al. / Strain-Invariant Conductors from Liquid Metal and Silver Microsheets. 2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025. Institute of Electrical and Electronics Engineers Inc., 2025. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

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title = "Strain-Invariant Conductors from Liquid Metal and Silver Microsheets",

abstract = "Flexible and stretchable metal conductors are essential for next-generation wearable electronics. However, ensuring their electrical stability under extreme tensile deformations poses a significant challenge. In this study, silver sheets (AgMS), arranged in a planar configuration, are deposited onto the surface of liquid metal (LM), specifically the eutectic gallium-indium alloy (EGaIn), using the Langmuir-Blodgett (LB) technique. Due to the strain-insensitive electron transport mechanism between the two materials, the LMI AgMS flexible wires maintain nearly unchanged electrical performance under extreme strain (300\%, R/Ro = 2.07), presenting a novel strategy for designing strain-insensitive stretchable wires.",

keywords = "failure analysis, Langmuir-Blodgett, reliability, stretchable wire",

author = "Junhao Shen and Jiajie Cui and Zewen Gan and Shaohua Zuo and Fuwen Shi and Tao Wang and Hengchang Bi and Xing Wu",

note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025 ; Conference date: 05-08-2025 Through 08-08-2025",

year = "2025",

doi = "10.1109/IPFA65338.2025.11256712",

language = "英语",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025",

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Shen, J, Cui, J, Gan, Z, Zuo, S, Shi, F, Wang, T, Bi, H & Wu, X 2025, Strain-Invariant Conductors from Liquid Metal and Silver Microsheets. in 2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Institute of Electrical and Electronics Engineers Inc., 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025, Bayan Lepas, Malaysia, 5/08/25. https://doi.org/10.1109/IPFA65338.2025.11256712

Strain-Invariant Conductors from Liquid Metal and Silver Microsheets. / Shen, Junhao; Cui, Jiajie; Gan, Zewen et al.
2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025. Institute of Electrical and Electronics Engineers Inc., 2025. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Shen, Junhao

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AU - Gan, Zewen

AU - Zuo, Shaohua

AU - Shi, Fuwen

AU - Wang, Tao

AU - Bi, Hengchang

AU - Wu, Xing

PY - 2025

Y1 - 2025

N2 - Flexible and stretchable metal conductors are essential for next-generation wearable electronics. However, ensuring their electrical stability under extreme tensile deformations poses a significant challenge. In this study, silver sheets (AgMS), arranged in a planar configuration, are deposited onto the surface of liquid metal (LM), specifically the eutectic gallium-indium alloy (EGaIn), using the Langmuir-Blodgett (LB) technique. Due to the strain-insensitive electron transport mechanism between the two materials, the LMI AgMS flexible wires maintain nearly unchanged electrical performance under extreme strain (300%, R/Ro = 2.07), presenting a novel strategy for designing strain-insensitive stretchable wires.

AB - Flexible and stretchable metal conductors are essential for next-generation wearable electronics. However, ensuring their electrical stability under extreme tensile deformations poses a significant challenge. In this study, silver sheets (AgMS), arranged in a planar configuration, are deposited onto the surface of liquid metal (LM), specifically the eutectic gallium-indium alloy (EGaIn), using the Langmuir-Blodgett (LB) technique. Due to the strain-insensitive electron transport mechanism between the two materials, the LMI AgMS flexible wires maintain nearly unchanged electrical performance under extreme strain (300%, R/Ro = 2.07), presenting a novel strategy for designing strain-insensitive stretchable wires.

KW - failure analysis

KW - Langmuir-Blodgett

KW - reliability

KW - stretchable wire

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T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

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Shen J, Cui J, Gan Z, Zuo S, Shi F, Wang T et al. Strain-Invariant Conductors from Liquid Metal and Silver Microsheets. In 2025 IEEE 32nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2025. Institute of Electrical and Electronics Engineers Inc. 2025. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA65338.2025.11256712

Strain-Invariant Conductors from Liquid Metal and Silver Microsheets

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