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Silicon-van der Waals heterointegration for CMOS-compatible logic-in-memory design

  • Mu Pai Lee
  • , Caifang Gao
  • , Meng Yu Tsai
  • , Che Yi Lin
  • , Feng Shou Yang
  • , Hsin Ya Sung
  • , Chi Zhang
  • , Wenwu Li*
  • , Jun Li
  • , Jianhua Zhang
  • , Kenji Watanabe
  • , Takashi Taniguchi
  • , Keiji Ueno
  • , Kazuhito Tsukagoshi
  • , Ching Hwa Ho
  • , Junhao Chu
  • , Po Wen Chiu
  • , Mengjiao Li*
  • , Wen Wei Wu*
  • , Yen Fu Lin*
  • *Corresponding author for this work
  • National Yang Ming Chiao Tung University
  • Fudan University
  • National Chung Hsing University
  • National Tsing Hua University
  • Shanghai University
  • National Institute for Materials Science Tsukuba
  • Saitama University
  • National Taiwan University of Science and Technology

Research output: Contribution to journalArticlepeer-review

Abstract

Silicon CMOS-based computing-in-memory encounters design and power challenges, especially in logic-in-memory scenarios requiring nonvolatility and reconfigurability. Here, we report a universal design for nonvolatile reconfigurable devices featuring a 2D/3D heterointegrated configuration. By leveraging the photo-controlled charge trapping/detrapping process and the partially top-gated energy band landscape, the van der Waals heterostacking achieves polarity storage and logic reconfigurable characteristics, respectively. Precise polarity tunability, logic nonvolatility, robustness against high temperature (at 85°C), and near-ideal subthreshold swing (80 mV dec−1) can be done. A comprehensive investigation of dynamic charge fluctuations provides a holistic understanding of the origins of nonvolatile reconfigurability (a trap level of 1013 cm−2 eV−1). Furthermore, we cascade such nonvolatile reconfigurable units into a monolithic circuit layer to demonstrate logic-in-memory computing possibilities, such as high-gain (65 at Vdd = 0.5 V) logic gates. This work provides an innovative 3D heterointegration prototype for future computing-in-memory hardware.

Original languageEnglish
Article numbereadk1597
JournalScience Advances
Volume9
Issue number49
DOIs
StatePublished - Dec 2023
Externally publishedYes

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