SiC Trench MOSFET with N-base Super Barrier Rectifier Embedded for Optimizing Reverse Characteristic

Zhengxun Deng, Xiaojin Li, Yabin Sun, Yanling Shi

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

A novel double trench SiC MOSFET embedded with N-base super barrier rectifier (NSBR-DTMOS) is proposed in this paper. The NSBR-DTMOS exhibits its diode turn on voltage (VF) half lower than that of body diode. With the super barrier rectifier (SBR) embedded as the freewheeling diode, the bipolar degradation phenomena caused by the body diode is eliminated successfully. Compared with the conventional DTMOS, the gate-to-drain capacitance (CGD) and gate-drain charge (QGD) are reduced by half, at the cost of the specific ON-resistance (Ron) increases by 9% only. As a result, the figures of merit Ron×QG and Ron×QGD are improved by 45% and 54% respectively.

Original languageEnglish
Title of host publication2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages101-102
Number of pages2
ISBN (Electronic)9781665417471
DOIs
StatePublished - 2021
Event2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021 - Zhuhai, China
Duration: 24 Nov 202126 Nov 2021

Publication series

Name2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021

Conference

Conference2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021
Country/TerritoryChina
CityZhuhai
Period24/11/2126/11/21

Keywords

  • SiC MOSFET
  • bipolar degradation
  • figure of merit
  • super barrier rectifier

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