Self-rectifying and forming-free unipolar HfO x based-high performance RRAM built by fab-avaialbe materials

X. A. Tran*, B. Gao, J. F. Kang, X. Wu, L. Wu, Z. Fang, Z. R. Wang, K. L. Pey, Y. C. Yeo, A. Y. Du, M. Liu, B. Y. Nguyen, M. F. Li, H. Y. Yu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

15 Scopus citations

Abstract

In this paper, we report a high performance, forming-free and self-rectifying unipolar HfO x based RRAM fabricated by fab-available materials. Highlight of the demonstrated RRAM include 1) CMOS technology friendly materials and process, 2) excellent self-rectifying behavior in LRS (>10 3 @ 1 V), 3) forming-free unipolar resistive switching, 4) wide read-out margin for high density cross-point memory devices (number of word-line >10 6 for worst case condition).

Original languageEnglish
Title of host publication2011 International Electron Devices Meeting, IEDM 2011
Pages31.2.1-31.2.4
DOIs
StatePublished - 2011
Externally publishedYes
Event2011 IEEE International Electron Devices Meeting, IEDM 2011 - Washington, DC, United States
Duration: 5 Dec 20117 Dec 2011

Publication series

NameTechnical Digest - International Electron Devices Meeting, IEDM
ISSN (Print)0163-1918

Conference

Conference2011 IEEE International Electron Devices Meeting, IEDM 2011
Country/TerritoryUnited States
CityWashington, DC
Period5/12/117/12/11

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