Seed-layer-free growth of ultra-thin Ag transparent conductive films imparts flexibility to polymer solar cells

  • Jinhua Huang
  • , Xiaohui Liu
  • , Yuehui Lu
  • , Yuhong Zhou
  • , Junjun Xu
  • , Jia Li
  • , Haiqiao Wang
  • , Junfeng Fang
  • , Ye Yang
  • , Weiyan Wang
  • , Ruiqin Tan
  • , Weijie Song*
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

56 Scopus citations

Abstract

In this work, by introducing Cu dopant, ultra-thin Ag transparent conductive films were prepared on glass and PET substrates without seed layers. The percolation threshold thickness for the Cu doped Ag thin films was as low as 6 nm with a RMS roughness only 0.19 nm. The prepared 6 nm Cu doped Ag thin films, Ag(Cu), had a transmittance of 80% at 550 nm and a sheet resistance of 14.1 Ω sq−1. The Ag(Cu) thin films revealed excellent thermal, chemical, and mechanical stability. Flexible polymer solar cells using the Ag(Cu) electrode reached a convert efficiency of 7.53% with a very thin PTB7-Th:PC71BM active layer. The proposed ultra-thin alloy transparent conductive films are ease of fabrication and beneficial to light harvesting, which are promising for large-area applications in flexible photovoltaics.

Original languageEnglish
Pages (from-to)73-81
Number of pages9
JournalSolar Energy Materials and Solar Cells
Volume184
DOIs
StatePublished - Sep 2018
Externally publishedYes

Keywords

  • Cu doped Ag film
  • Flexible electronics
  • Polymer solar cells
  • Transparent electrode

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