Resistance of alumina-copper composite to thermal shock

Lin Wang; Jian Lin Shi; Dong Sheng Yan

doi:10.2109/jcersj.108.1264_1115

Resistance of alumina-copper composite to thermal shock

Lin Wang^*
, Jian Lin Shi
, Dong Sheng Yan

^*Corresponding author for this work

CAS - Shanghai Institute of Ceramics

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

The present work is concerned with the thermal shock behavior of a ceramic matrix composite consisting of an alumina base containing 5 vol% of copper particles. The composite, hot-pressed at 1550°C, exhibited increased flexural strength, enhanced toughness and higher resistance to thermal shock compared with monolithic alumina. Some mechanical and thermal properties relevant to thermal shock were discussed which gave plausible explanations for the differences between the composite and the monolithic alumina.

Original language	English
Pages (from-to)	1115-1116
Number of pages	2
Journal	Journal of the Ceramic Society of Japan
Volume	108
Issue number	12
DOIs	https://doi.org/10.2109/jcersj.108.1264_1115
State	Published - 2000
Externally published	Yes

Keywords

Copper particles and retained strength
Copper-dispersed composite
Thermal shock resistance

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10.2109/jcersj.108.1264_1115

Cite this

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title = "Resistance of alumina-copper composite to thermal shock",

abstract = "The present work is concerned with the thermal shock behavior of a ceramic matrix composite consisting of an alumina base containing 5 vol\% of copper particles. The composite, hot-pressed at 1550°C, exhibited increased flexural strength, enhanced toughness and higher resistance to thermal shock compared with monolithic alumina. Some mechanical and thermal properties relevant to thermal shock were discussed which gave plausible explanations for the differences between the composite and the monolithic alumina.",

keywords = "Copper particles and retained strength, Copper-dispersed composite, Thermal shock resistance",

author = "Lin Wang and Shi, \{Jian Lin\} and Yan, \{Dong Sheng\}",

year = "2000",

doi = "10.2109/jcersj.108.1264\_1115",

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volume = "108",

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AU - Wang, Lin

AU - Shi, Jian Lin

AU - Yan, Dong Sheng

PY - 2000

Y1 - 2000

N2 - The present work is concerned with the thermal shock behavior of a ceramic matrix composite consisting of an alumina base containing 5 vol% of copper particles. The composite, hot-pressed at 1550°C, exhibited increased flexural strength, enhanced toughness and higher resistance to thermal shock compared with monolithic alumina. Some mechanical and thermal properties relevant to thermal shock were discussed which gave plausible explanations for the differences between the composite and the monolithic alumina.

AB - The present work is concerned with the thermal shock behavior of a ceramic matrix composite consisting of an alumina base containing 5 vol% of copper particles. The composite, hot-pressed at 1550°C, exhibited increased flexural strength, enhanced toughness and higher resistance to thermal shock compared with monolithic alumina. Some mechanical and thermal properties relevant to thermal shock were discussed which gave plausible explanations for the differences between the composite and the monolithic alumina.

KW - Copper particles and retained strength

KW - Copper-dispersed composite

KW - Thermal shock resistance

UR - https://www.scopus.com/pages/publications/18244369478

U2 - 10.2109/jcersj.108.1264_1115

DO - 10.2109/jcersj.108.1264_1115

M3 - 文章

AN - SCOPUS:18244369478

SN - 1882-0743

VL - 108

SP - 1115

EP - 1116

JO - Journal of the Ceramic Society of Japan

JF - Journal of the Ceramic Society of Japan

IS - 12

ER -

Resistance of alumina-copper composite to thermal shock

Abstract

Keywords

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