Research for polyimide as a sacrificial layer in MEMS device

Meili Hu; Jinjin Chen; Zongsheng Lai; Huibing Mao; Dexin Sheng

doi:10.1117/12.608035

Research for polyimide as a sacrificial layer in MEMS device

Meili Hu
, Jinjin Chen
, Zongsheng Lai^*
, Huibing Mao
, Dexin Sheng

^*Corresponding author for this work

School of Physics and Electronic Science

East China Normal University

Research output: Contribution to journal › Conference article › peer-review

2 Scopus citations

Abstract

Polyimide has been an important sacrificial layer material in the MEMS switch. Polyimide can be spun and photographied on silicon substrate. NaOH liquid can etch and develop polyimide. Then it needs to cure. After MEMS switch are manufactured, polyimide must be removed. The different cure temperature and time impacts the character of polyimide. The experiment result shows that it is easy to remove and can be lithographed. So it is suitable for microwave device. In this paper, refers that polyimide can be etched by NaOH, O₂ and CF₄.

Original language	English
Article number	150
Pages (from-to)	642-645
Number of pages	4
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	5774
DOIs	https://doi.org/10.1117/12.608035
State	Published - 2005
Event	Fifth International Conference on Thin Film Physics and Applications - Shanghai, China Duration: 31 May 2004 → 2 Jun 2004

Keywords

Air bridge
Baking
CF
Cure
Etching
MEMS
NaOH
O
Polyimide
Sacrificial layer

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10.1117/12.608035

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title = "Research for polyimide as a sacrificial layer in MEMS device",

abstract = "Polyimide has been an important sacrificial layer material in the MEMS switch. Polyimide can be spun and photographied on silicon substrate. NaOH liquid can etch and develop polyimide. Then it needs to cure. After MEMS switch are manufactured, polyimide must be removed. The different cure temperature and time impacts the character of polyimide. The experiment result shows that it is easy to remove and can be lithographed. So it is suitable for microwave device. In this paper, refers that polyimide can be etched by NaOH, O2 and CF4.",

keywords = "Air bridge, Baking, CF, Cure, Etching, MEMS, NaOH, O, Polyimide, Sacrificial layer",

author = "Meili Hu and Jinjin Chen and Zongsheng Lai and Huibing Mao and Dexin Sheng",

year = "2005",

doi = "10.1117/12.608035",

language = "英语",

volume = "5774",

pages = "642--645",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "Fifth International Conference on Thin Film Physics and Applications ; Conference date: 31-05-2004 Through 02-06-2004",

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TY - JOUR

T1 - Research for polyimide as a sacrificial layer in MEMS device

AU - Hu, Meili

AU - Chen, Jinjin

AU - Lai, Zongsheng

AU - Mao, Huibing

AU - Sheng, Dexin

PY - 2005

Y1 - 2005

N2 - Polyimide has been an important sacrificial layer material in the MEMS switch. Polyimide can be spun and photographied on silicon substrate. NaOH liquid can etch and develop polyimide. Then it needs to cure. After MEMS switch are manufactured, polyimide must be removed. The different cure temperature and time impacts the character of polyimide. The experiment result shows that it is easy to remove and can be lithographed. So it is suitable for microwave device. In this paper, refers that polyimide can be etched by NaOH, O2 and CF4.

AB - Polyimide has been an important sacrificial layer material in the MEMS switch. Polyimide can be spun and photographied on silicon substrate. NaOH liquid can etch and develop polyimide. Then it needs to cure. After MEMS switch are manufactured, polyimide must be removed. The different cure temperature and time impacts the character of polyimide. The experiment result shows that it is easy to remove and can be lithographed. So it is suitable for microwave device. In this paper, refers that polyimide can be etched by NaOH, O2 and CF4.

KW - Air bridge

KW - Baking

KW - CF

KW - Cure

KW - Etching

KW - MEMS

KW - NaOH

KW - O

KW - Polyimide

KW - Sacrificial layer

UR - https://www.scopus.com/pages/publications/25644451368

U2 - 10.1117/12.608035

DO - 10.1117/12.608035

M3 - 会议文章

AN - SCOPUS:25644451368

SN - 0277-786X

VL - 5774

SP - 642

EP - 645

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

M1 - 150

T2 - Fifth International Conference on Thin Film Physics and Applications

Y2 - 31 May 2004 through 2 June 2004

ER -

Research for polyimide as a sacrificial layer in MEMS device

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Keywords

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