Reliability study of the three-dimensional porous flexible resistive pressure sensor

  • Junhao Shen
  • , Yuhan Sun
  • , Danni Gong
  • , Xinyue Zheng
  • , Shaohua Zuo
  • , Fuwen Shi
  • , Xing Wu*
  • , Hengchang Bi
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Driven by the growing demands in artificial intelligence, health detection, and human-machine interaction, flexible pressure sensors, an indispensable branch of wearable electronics, have attracted attention for their wide range of applications. The flexible pressure sensor with a three-dimensional (3D) porous conductive sponge as the sensitive layer, whose resistance value changes with external pressure stimulation, has become a cutting-edge device. However, there are still issues on the reliability of flexible porous pressure devices composed of soft matter under sustained large pressure loads. In this work, a flexible porous pressure device developed based on polydimethylsiloxane (PDMS)/carbon black (CB)-attached porous composite sensitive layer was fabricated. The results show that PDMS can be used as a homogeneous binder to assist CB in attaching stably to the porous framework surface, avoiding the slipping and detachment of CB under the large strain of the framework. Under continuous loadings at 1000 kPa, the PDMS/CB@PDMS device did not experience significant initial resistance drift.

Original languageEnglish
Title of host publication2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350301649
DOIs
StatePublished - 2023
Event2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 - Pulau Pinang, Malaysia
Duration: 24 Jul 202327 Jul 2023

Publication series

NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume2023-July

Conference

Conference2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
Country/TerritoryMalaysia
CityPulau Pinang
Period24/07/2327/07/23

Keywords

  • device reliability
  • flexible pressure sensor
  • three-dimensional conductive sponge

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