Reliability study of the three-dimensional porous flexible resistive pressure sensor

Junhao Shen; Yuhan Sun; Danni Gong; Xinyue Zheng; Shaohua Zuo; Fuwen Shi; Xing Wu; Hengchang Bi

doi:10.1109/IPFA58228.2023.10249188

Reliability study of the three-dimensional porous flexible resistive pressure sensor

Junhao Shen
, Yuhan Sun
, Danni Gong
, Xinyue Zheng
, Shaohua Zuo
, Fuwen Shi
, Xing Wu^*
, Hengchang Bi

^*Corresponding author for this work

School of Communication and Electronic Engineering

East China Normal University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Driven by the growing demands in artificial intelligence, health detection, and human-machine interaction, flexible pressure sensors, an indispensable branch of wearable electronics, have attracted attention for their wide range of applications. The flexible pressure sensor with a three-dimensional (3D) porous conductive sponge as the sensitive layer, whose resistance value changes with external pressure stimulation, has become a cutting-edge device. However, there are still issues on the reliability of flexible porous pressure devices composed of soft matter under sustained large pressure loads. In this work, a flexible porous pressure device developed based on polydimethylsiloxane (PDMS)/carbon black (CB)-attached porous composite sensitive layer was fabricated. The results show that PDMS can be used as a homogeneous binder to assist CB in attaching stably to the porous framework surface, avoiding the slipping and detachment of CB under the large strain of the framework. Under continuous loadings at 1000 kPa, the PDMS/CB@PDMS device did not experience significant initial resistance drift.

Original language	English
Title of host publication	2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9798350301649
DOIs	https://doi.org/10.1109/IPFA58228.2023.10249188
State	Published - 2023
Event	2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 - Pulau Pinang, Malaysia Duration: 24 Jul 2023 → 27 Jul 2023

Publication series

Name	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Volume	2023-July

Conference

Conference	2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023
Country/Territory	Malaysia
City	Pulau Pinang
Period	24/07/23 → 27/07/23

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 3 Good Health and Well-being

Keywords

device reliability
flexible pressure sensor
three-dimensional conductive sponge

Access to Document

10.1109/IPFA58228.2023.10249188

Cite this

Shen, J., Sun, Y., Gong, D., Zheng, X., Zuo, S., Shi, F., Wu, X., & Bi, H. (2023). Reliability study of the three-dimensional porous flexible resistive pressure sensor. In 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2023-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPFA58228.2023.10249188

Shen, Junhao ; Sun, Yuhan ; Gong, Danni et al. / Reliability study of the three-dimensional porous flexible resistive pressure sensor. 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023. Institute of Electrical and Electronics Engineers Inc., 2023. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).

@inproceedings{7cb73149dde84d4cb60a73573b2753cc,

title = "Reliability study of the three-dimensional porous flexible resistive pressure sensor",

abstract = "Driven by the growing demands in artificial intelligence, health detection, and human-machine interaction, flexible pressure sensors, an indispensable branch of wearable electronics, have attracted attention for their wide range of applications. The flexible pressure sensor with a three-dimensional (3D) porous conductive sponge as the sensitive layer, whose resistance value changes with external pressure stimulation, has become a cutting-edge device. However, there are still issues on the reliability of flexible porous pressure devices composed of soft matter under sustained large pressure loads. In this work, a flexible porous pressure device developed based on polydimethylsiloxane (PDMS)/carbon black (CB)-attached porous composite sensitive layer was fabricated. The results show that PDMS can be used as a homogeneous binder to assist CB in attaching stably to the porous framework surface, avoiding the slipping and detachment of CB under the large strain of the framework. Under continuous loadings at 1000 kPa, the PDMS/CB@PDMS device did not experience significant initial resistance drift.",

keywords = "device reliability, flexible pressure sensor, three-dimensional conductive sponge",

author = "Junhao Shen and Yuhan Sun and Danni Gong and Xinyue Zheng and Shaohua Zuo and Fuwen Shi and Xing Wu and Hengchang Bi",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023 ; Conference date: 24-07-2023 Through 27-07-2023",

year = "2023",

doi = "10.1109/IPFA58228.2023.10249188",

language = "英语",

series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023",

address = "美国",

}

Shen, J, Sun, Y, Gong, D, Zheng, X, Zuo, S, Shi, F, Wu, X & Bi, H 2023, Reliability study of the three-dimensional porous flexible resistive pressure sensor. in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, vol. 2023-July, Institute of Electrical and Electronics Engineers Inc., 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023, Pulau Pinang, Malaysia, 24/07/23. https://doi.org/10.1109/IPFA58228.2023.10249188

Reliability study of the three-dimensional porous flexible resistive pressure sensor. / Shen, Junhao; Sun, Yuhan; Gong, Danni et al.
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023. Institute of Electrical and Electronics Engineers Inc., 2023. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA; Vol. 2023-July).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Reliability study of the three-dimensional porous flexible resistive pressure sensor

AU - Shen, Junhao

AU - Sun, Yuhan

AU - Gong, Danni

AU - Zheng, Xinyue

AU - Zuo, Shaohua

AU - Shi, Fuwen

AU - Wu, Xing

AU - Bi, Hengchang

PY - 2023

Y1 - 2023

N2 - Driven by the growing demands in artificial intelligence, health detection, and human-machine interaction, flexible pressure sensors, an indispensable branch of wearable electronics, have attracted attention for their wide range of applications. The flexible pressure sensor with a three-dimensional (3D) porous conductive sponge as the sensitive layer, whose resistance value changes with external pressure stimulation, has become a cutting-edge device. However, there are still issues on the reliability of flexible porous pressure devices composed of soft matter under sustained large pressure loads. In this work, a flexible porous pressure device developed based on polydimethylsiloxane (PDMS)/carbon black (CB)-attached porous composite sensitive layer was fabricated. The results show that PDMS can be used as a homogeneous binder to assist CB in attaching stably to the porous framework surface, avoiding the slipping and detachment of CB under the large strain of the framework. Under continuous loadings at 1000 kPa, the PDMS/CB@PDMS device did not experience significant initial resistance drift.

AB - Driven by the growing demands in artificial intelligence, health detection, and human-machine interaction, flexible pressure sensors, an indispensable branch of wearable electronics, have attracted attention for their wide range of applications. The flexible pressure sensor with a three-dimensional (3D) porous conductive sponge as the sensitive layer, whose resistance value changes with external pressure stimulation, has become a cutting-edge device. However, there are still issues on the reliability of flexible porous pressure devices composed of soft matter under sustained large pressure loads. In this work, a flexible porous pressure device developed based on polydimethylsiloxane (PDMS)/carbon black (CB)-attached porous composite sensitive layer was fabricated. The results show that PDMS can be used as a homogeneous binder to assist CB in attaching stably to the porous framework surface, avoiding the slipping and detachment of CB under the large strain of the framework. Under continuous loadings at 1000 kPa, the PDMS/CB@PDMS device did not experience significant initial resistance drift.

KW - device reliability

KW - flexible pressure sensor

KW - three-dimensional conductive sponge

UR - https://www.scopus.com/pages/publications/85173573961

U2 - 10.1109/IPFA58228.2023.10249188

DO - 10.1109/IPFA58228.2023.10249188

M3 - 会议稿件

AN - SCOPUS:85173573961

T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

BT - 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023

Y2 - 24 July 2023 through 27 July 2023

ER -

Shen J, Sun Y, Gong D, Zheng X, Zuo S, Shi F et al. Reliability study of the three-dimensional porous flexible resistive pressure sensor. In 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2023. Institute of Electrical and Electronics Engineers Inc. 2023. (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). doi: 10.1109/IPFA58228.2023.10249188

Reliability study of the three-dimensional porous flexible resistive pressure sensor

Abstract

Publication series

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UN SDGs

Keywords

Access to Document

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